Section Diagrams, Circuit Boards Location | Sony MDS-JE640 instruction

SECTION 6

DIAGRAMS

6-1. CIRCUIT BOARDS LOCATION

	VOL-SEL board
PT board	(MY, SP model)

KEY-SW board

MAIN board

HP board

KB board

BD board

DISPLAY board

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.

(In addition to this, the necessary note is printed in each block.)

For schematic diagrams.

Note:

•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•f : internal component.

•2: nonflammable resistor.

•1: fusible resistor.

•C: panel designation.

Note:	Note:
The components identi-	Les composants identifiés par
fied by mark 0or dotted	une marque 0sont critiques
line with mark 0are criti-	pour la sécurité.
cal for safety.	Ne les remplacer que par une
Replace only with part	pié ce portant le numé ro
number specified.	spécifié.

•U : B+ Line.

•V : B– Line.

•H: adjustment for repair.

•Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions.

•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

E : PB

j : REC

p: PB (DIGITAL OUT)

l: REC (DIGITAL IN)

•Abbreviation

CND	: Canadian model
SP	: Singapore model
MY	: Malaysia model

For printed wiring boards.

Note:

•X: parts extracted from the component side.

•Y: parts extracted from the conductor side.

•a : Through hole.

•b: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:

Pattern face side: Parts on the pattern face side seen from the

(Side B) pattern face are indicated.

Parts face side: Parts on the parts face side seen from the

(Side A)

parts face are indicated.

• Indication of transistor

B C E

These are omitted.

B C E

These are omitted.

C


			Q							These are omitted.
			Q							These are omitted.

B E

31 31

Image 31

Sony MDS-JE640 specifications Section Diagrams, Circuit Boards Location, For schematic diagrams, For printed wiring boards

Contents

NEW SpecificationsInputs Outputs Three- or five Digit code Cause/Remedy Message Supplied accessoriesSELF-DIAGNOSIS Function General Items of Error History Mode Items and Contents Exploded Views Table of ContentsDisassembly Diagrams Flexible Circuit Board Repairing Section Service Notes IOP JIG for Checking BD Board Waveform Record Precedure Forced Reset Checks Prior to Parts Replacement and AdjustmentsMain Board Component Side Bit Binary Retry Cause Display Mode Hexadecimal t Binary Conversion Table Section General Front Panel Section Section Disassembly PT BOARD, VOL-SEL Board Main Board BD Board Mechanism Deck Section MDM-7A Exiting the Test Mode Section Test ModePrecautions for USE of Test Mode Setting the Test Mode Display Details Mark Group Selecting the Test Mode MENU/NO Operating the Continuous Playback Mode Functions of Other Buttons Test Mode DisplaysMode display Error rate display Information When Memory NG is DisplayedMeanings of Other Displays Automatic SELF-DIAGNOSIS Function Parts Replacement and Adjustment Section Electrical AdjustmentsCheck before replacement YES Adjustment flow Precautions for USE of Optical PICK- UP KMS-260B Precautions for Checking Laser Diode EmissionPrecautions for Adjustments Checks Prior to Repairs Using the Continuously Recorded Disc Other Checks Auto Check CD Error Rate Check Play Check MO Error Rate Check Temperature Compensation Offset Adjutment Initial Setting of Adjustment ValueLaser Power Adjustment Iop NV Save Traverse Adjustment YES Focus Bias Adjustment MO Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment CD Auto Gain Control Output Level Adjustment Adjusting Points and Connecting Points Circuit Boards Location Section DiagramsFor schematic diagrams For printed wiring boards Signal Path Block Diagrams BD SectionMDS-JE640 REC Analog Main Section Main Board BD BoardDisplay Board Semiconductor Printed Wiring Board BD Section PIN PIN Function Printed Wiring Board Main Section Side a IC1 Printed Wiring Board Main Section Side BIC2 PIN MDS-JE640 Schematic Diagram Main /3 See page 47 for IC Block Diagrams Printed Wiring Board Power Section Printed Wiring Board Display Section Schematic Diagram Display Section See page 34 for Waveforms IC101 CXA2523AR BD Board IC Block Diagrams IC400 LA5643 Main Board IC101 CXA2523AR RF Amplifier BD Board IC PIN Functions MNT0 FOK Mvci Tfdr IC1 M30805SGP System Control Main Board HLDA/ALE Chassis Section Section Exploded Views Panel ASSY, Front Silver Panel ASSY, Front Black AEP,UK,CIS,SP,MY 202 220 201 213 215 216 205 218 207 Mechanism MDM-7A Motor ASSY, Loading HEAD, Over LightMotor ASSY, Spindle Motor ASSY, Sled Section Electrical Parts List IC BA033FP-E2 IC TC7WU04FUTE12RMetal Chip IC MC74ACT08DTR2 Display KEY-SW Main PLUG, Connector 10P Diode PIN, Connector 3PCONNECTOR, FFC 17P PIN, Connector 4P Transistor UN2111-TX IC SN74LVU04ANSRAEP,UK,CIS Transistor UN2211-TX Composition Circuit Block ConnectorTRANSFORMER, Power CND TRANSFORMER, Power SP,MY VOL-SEL Sony Corporation