Section Service Notes | Sony MDS-JE640 manual

SECTION 1

SERVICE NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The

CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radia- tion exposure.

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of soldering iron around 270˚C during repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS

LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES

DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

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Sony MDS-JE640 specifications Section Service Notes, Flexible Circuit Board Repairing

Contents

Inputs SpecificationsOutputs NEW SELF-DIAGNOSIS Function Supplied accessoriesGeneral Three- or five Digit code Cause/Remedy Message Items of Error History Mode Items and Contents Disassembly Table of ContentsDiagrams Exploded Views Flexible Circuit Board Repairing Section Service Notes IOP JIG for Checking BD Board Waveform Record Precedure Main Board Component Side Checks Prior to Parts Replacement and AdjustmentsForced Reset Bit Binary Retry Cause Display Mode Hexadecimal t Binary Conversion Table Section General Front Panel Section Section Disassembly PT BOARD, VOL-SEL Board Main Board BD Board Mechanism Deck Section MDM-7A Precautions for USE of Test Mode Section Test ModeSetting the Test Mode Exiting the Test Mode Display Details Mark Group Selecting the Test Mode MENU/NO Operating the Continuous Playback Mode Mode display Test Mode DisplaysError rate display Functions of Other Buttons Meanings of Other Displays When Memory NG is DisplayedAutomatic SELF-DIAGNOSIS Function Information Check before replacement Section Electrical AdjustmentsParts Replacement and Adjustment YES Adjustment flow Precautions for Adjustments Precautions for Checking Laser Diode EmissionPrecautions for USE of Optical PICK- UP KMS-260B Checks Prior to Repairs Using the Continuously Recorded Disc Other Checks Auto Check CD Error Rate Check Play Check MO Error Rate Check Laser Power Adjustment Initial Setting of Adjustment ValueTemperature Compensation Offset Adjutment Iop NV Save Traverse Adjustment YES Focus Bias Adjustment Auto Gain Control Output Level Adjustment Error Rate CheckCD Auto Gain Control Output Level Adjustment MO Auto Gain Control Output Level Adjustment Adjusting Points and Connecting Points For schematic diagrams Section DiagramsFor printed wiring boards Circuit Boards Location MDS-JE640 Block Diagrams BD SectionSignal Path REC Analog Main Section Display Board BD BoardMain Board Semiconductor Printed Wiring Board BD Section PIN PIN Function Printed Wiring Board Main Section Side a IC2 Printed Wiring Board Main Section Side BIC1 PIN MDS-JE640 Schematic Diagram Main /3 See page 47 for IC Block Diagrams Printed Wiring Board Power Section Printed Wiring Board Display Section Schematic Diagram Display Section See page 34 for Waveforms IC101 CXA2523AR BD Board IC Block Diagrams IC400 LA5643 Main Board IC101 CXA2523AR RF Amplifier BD Board IC PIN Functions MNT0 FOK Mvci Tfdr IC1 M30805SGP System Control Main Board HLDA/ALE Chassis Section Section Exploded Views Panel ASSY, Front Silver Panel ASSY, Front Black AEP,UK,CIS,SP,MY 202 220 201 213 215 216 205 218 207 Mechanism MDM-7A Motor ASSY, Spindle HEAD, Over LightMotor ASSY, Sled Motor ASSY, Loading Section Electrical Parts List Metal Chip IC TC7WU04FUTE12RIC MC74ACT08DTR2 IC BA033FP-E2 Display KEY-SW Main CONNECTOR, FFC 17P PIN, Connector 3PPIN, Connector 4P PLUG, Connector 10P Diode AEP,UK,CIS IC SN74LVU04ANSRTransistor UN2211-TX Transistor UN2111-TX TRANSFORMER, Power CND ConnectorTRANSFORMER, Power SP,MY Composition Circuit Block VOL-SEL Sony Corporation