Sony MZ-B100 specifications Table of Contents, Disassembly, Diagrams, Exploded View

MZ-B100

General

Power requirements DC 3V

LR6 (size AA) alkaline dry battery (world model only) Battery operation time

Battery life 1)
When recording2)3)	(Unit: approx.hours) (JEITA4))
Recording mode	Approx. hours
Stereo	9
LP2 Stereo	12.5
LP4 Stereo	15
MONO	12

1)The battery life may be shorter due to operating conditions and the temperature of the location.

2)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan). Recording time may differ according to the alkaline batteries.

3)When recorded with the built-in microphones.

4)Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard.

When playing1)	(Unit: approx.hours) (JEITA2))
Recording mode	Speaker 3)	Headphones 4)
Stereo	25.5	34.5
LP2 Stereo	27	39.5
LP4 Stereo	30	43
MONO	30	43

1)When using a Sony LR6 (SG) “STAMINA” alkaline dry battery (produced in Japan).

2)Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard.

3)When played using the built-in speaker.

3)When played using headphones.

Dimensions

Approx. 105.7 ⋅ 80.0 ⋅ 24.9 mm (w/h/d)

(4 1/4 ⋅ 3 1/8 ⋅ 1 in.) not incl. projecting parts and controls.

Mass

Approx. 160 g (5.7 oz) (main unit only) Supplied accessories

Remote control (1) Headphones (1) Carrying pouch (1) Hand strap (1)

Sony LR6 (size AA) alkaline dry battery (1)

1)The LINE IN (OPTICAL) jack is used to connect either a digital (optical) cable or a line (analog) cable.

2)Measured in accordance with JEITA.

Design and specifications are subject to change without notice.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270°C during repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

		TABLE OF CONTENTS
1.	SERVICING NOTES		3
2.	GENERAL		4
3.	DISASSEMBLY
	3-1.	Panel (Lower) ASSY	6
	3-2.	Main Board	6
	3-3.	Cabinet (Belt) Section	7
	3-4.	Key Board Unit	7
	3-5.	Mechanism Deck	8
	3-6.	Optical Pick-up Block (LCX-4R)	9
	3-7.	Holder ASSY	10
	3-8.	Motor, DC (Sled) (M602)	10
	3-9.	“Motor, DC (Spindle) (M601)”,
		“Motor, DC (Over Write Head Up/Down) (M603)” ... 11
4.	TEST MODE		12
5.	ELECTRICAL ADJUSTMENTS		19
6.	DIAGRAMS
	6-1.	Explanation of IC Terminals	24
	6-2.	Block Diagrams (Main Section (1/3)	30
	6-3.	Block Diagrams (Main Section (2/3)	31
	6-4.	Block Diagrams (Main Section (3/3)	32
	6-5.	Printed Wiring Board (Main Section (1/2))	33
	6-6.	Printed Wiring Board (Main Section (2/2))	34
	6-7.	Schematic Diagram (Main Section (1/4))	35
	6-8.	Schematic Diagram (Main Section (2/4))	36
	6-9.	Schematic Diagram (Main Section (3/4))	37
	6-10.	Schematic Diagram (Main Section (4/4))	38
7.	EXPLODED VIEW
	7-1.	Panel (Lower) Section	42
	7-2.	Panel (Upper Lid) Section	43
	7-3.	Cabinet (Belt) Section	44
	7-4.	Mechanism Deck Section (MT-MZB100-171)	45
8.	ELECTRICAL PARTS LIST		46

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE

PARTS LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

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