Pin No. | Pin name | I/O | Description |
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220 | XRST MTR DRV | O | Reset control signal output to the motor driver (IC701) |
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221 | XRF RST | O | Reset control signal output to RF amp (IC501) |
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222 | MCUVDD3 | — | Power supply terminal (for the microcomputer block) (+1.5V) |
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223 | SPDL MON | I | Spindle servo monitor signal input from the motor driver (IC701) |
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224 | XAVLS | I | Input terminal for AVLS switch detection signal |
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225, 226 | JOG A, B | I | Jog dial pulse input terminal from the switch & LCD module |
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227 | XHOLD SW | I | HOLD switch (S801) input terminal “L”: hold ON, “H”: hold OFF |
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228 | SYNC REC | I | SYNCHRO REC switch (S802) input terminal “L”: OFF, “H”: ON | Not used (open) |
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229 | TSB SSB CTL | O | TSB/SSB changeover control signal output Not used (open) |
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230 | PROTECT | I | Detection input terminal of the record check claw from the protect detection switch (S803) | |
“L”: recording possible condition, “H”: protect |
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231 | FLASHVDD | — | Power supply terminal (for the internal FLASH ROM) (+2.4V) |
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232 | FLASHVSS | — | Ground terminal (for the internal FLASH ROM) |
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233 | SLD MON | I | Sled servo monitor signal input from the motor driver (IC701) |
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234 | VLON | O | Power supply control signal output for the laser diode drive to the power control (IC901) | |
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235 | SLEEP | O | System sleep control signal output to the power control (IC901) “H”: sleep ON | |
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236 | FFCLR | O | Input latch output for the start switching to the power control (IC901) |
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237 | CHG GAIN | O | Charge gain control signal output to the power control (IC601) |
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238 | CHG | O | Charge ON/OFF control signal output to the power control (IC601) | “H”: charge ON |
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239 | TUN REG ON | O | Not used (open) |
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240 | XHP STBY | O | Power supply control signal output terminal for the headphone amp | Not used (open) |
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241 | MIFVDD3 | — | Power supply terminal (for the microcomputer I/F block) (+2.3V) |
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242 | MIFVSS2 | — | Ground terminal (for the microcomputer I/F block) |
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243 | TEST2 | I | Input terminal for the main test (normally open) |
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244 | NC | — | Not used (open) |
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Note on Schematic Diagram:
•All capacitors are in ∝F unless otherwise noted. pF: ∝∝F 50 WV or less are not indicated except for electrolytics and tantalums.
•All resistors are in Ω and 1/4 W or less unless otherwise specified.
•% : indicates tolerance.
•f : internal component.
Note: The components identified by mark 0or dotted line with mark 0are critical for safety.
Replace only with part number specified.
•A : B+ Line.
•Power voltage is dc 3 V and fed with regulated dc power supply from external power voltage jack.
•Voltages and waveforms are dc with respect to ground under
no mark : PLAYBACK
( ) : RECORD
∗: Impossible to measure
•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc- tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
E : PLAYBACK
j : PLAYBACK (ANALOG IN)
l : RECORD (DEGITAL IN)
•Replacement of IC801 used in this set requires a special tool.
•The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.
Note on Printed Wiring Board:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•x : parts mounted on the conductor side.
•z : Through hole.
• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)
Caution: |
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Pattern face side: | Parts on the pattern face side seen from |
(Conductor Side) | the pattern face are indicated. |
Parts face side: | Parts on the parts face side seen from |
(Component Side) | the parts face are indicated. |
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•Main board is
However, the patterns of layers 2 and 3 have not been included in this diagrams.
•Replacement of IC801 used in this set requires a special tool.
• Lead Layouts | surface |
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Lead layout of conventional IC | CSP (chip size package) |
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