Sony MZ-B100 specifications 0.56 sec, 45.1584MHz, zWaveforms, IC601, 2.3Vp-p, IC901, IC801, Osco

Models: MZ-B100

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zWaveforms

Pin No.

Pin name

I/O

Description

 

 

 

 

 

 

220

XRST MTR DRV

O

Reset control signal output to the motor driver (IC701)

 

 

 

 

 

 

221

XRF RST

O

Reset control signal output to RF amp (IC501)

 

 

 

 

 

 

222

MCUVDD3

Power supply terminal (for the microcomputer block) (+1.5V)

 

 

 

 

 

 

223

SPDL MON

I

Spindle servo monitor signal input from the motor driver (IC701)

 

 

 

 

 

 

224

XAVLS

I

Input terminal for AVLS switch detection signal

 

 

 

 

 

 

225, 226

JOG A, B

I

Jog dial pulse input terminal from the switch & LCD module

 

 

 

 

 

 

227

XHOLD SW

I

HOLD switch (S801) input terminal “L”: hold ON, “H”: hold OFF

 

 

 

 

 

 

228

SYNC REC

I

SYNCHRO REC switch (S802) input terminal “L”: OFF, “H”: ON

Not used (open)

 

 

 

 

 

229

TSB SSB CTL

O

TSB/SSB changeover control signal output Not used (open)

 

 

 

 

 

230

PROTECT

I

Detection input terminal of the record check claw from the protect detection switch (S803)

“L”: recording possible condition, “H”: protect

 

 

 

 

 

 

 

 

 

 

231

FLASHVDD

Power supply terminal (for the internal FLASH ROM) (+2.4V)

 

 

 

 

 

 

232

FLASHVSS

Ground terminal (for the internal FLASH ROM)

 

 

 

 

 

 

233

SLD MON

I

Sled servo monitor signal input from the motor driver (IC701)

 

 

 

 

 

234

VLON

O

Power supply control signal output for the laser diode drive to the power control (IC901)

 

 

 

 

235

SLEEP

O

System sleep control signal output to the power control (IC901) “H”: sleep ON

 

 

 

 

 

236

FFCLR

O

Input latch output for the start switching to the power control (IC901)

 

 

 

 

 

 

237

CHG GAIN

O

Charge gain control signal output to the power control (IC601)

 

 

 

 

 

 

238

CHG

O

Charge ON/OFF control signal output to the power control (IC601)

“H”: charge ON

 

 

 

 

 

239

TUN REG ON

O

Not used (open)

 

 

 

 

 

 

240

XHP STBY

O

Power supply control signal output terminal for the headphone amp

Not used (open)

 

 

 

 

 

241

MIFVDD3

Power supply terminal (for the microcomputer I/F block) (+2.3V)

 

 

 

 

 

 

242

MIFVSS2

Ground terminal (for the microcomputer I/F block)

 

 

 

 

 

 

243

TEST2

I

Input terminal for the main test (normally open)

 

 

 

 

 

 

244

NC

Not used (open)

 

 

 

 

 

 

Note on Schematic Diagram:

All capacitors are in F unless otherwise noted. pF: ∝∝F 50 WV or less are not indicated except for electrolytics and tantalums.

All resistors are in and 1/4 W or less unless otherwise specified.

% : indicates tolerance.

f : internal component.

Note: The components identified by mark 0or dotted line with mark 0are critical for safety.

Replace only with part number specified.

A : B+ Line.

Power voltage is dc 3 V and fed with regulated dc power supply from external power voltage jack.

Voltages and waveforms are dc with respect to ground under no-signal conditions.

no mark : PLAYBACK

( ) : RECORD

: Impossible to measure

Voltages are taken with a VOM (Input impedance 10 M). Voltage variations may be noted due to normal produc- tion tolerances.

Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

Circled numbers refer to waveforms.

Signal path.

E : PLAYBACK

j : PLAYBACK (ANALOG IN)

l : RECORD (DEGITAL IN)

Replacement of IC801 used in this set requires a special tool.

The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.

Note on Printed Wiring Board:

X: parts extracted from the component side.

Y: parts extracted from the conductor side.

x : parts mounted on the conductor side.

z : Through hole.

0.56 secIC601 : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:

 

Pattern face side:

Parts on the pattern face side seen from

(Conductor Side)

the pattern face are indicated.

Parts face side:

Parts on the parts face side seen from

(Component Side)

the parts face are indicated.

 

 

Main board is four-layer printed board.

However, the patterns of layers 2 and 3 have not been included in this diagrams.

Replacement of IC801 used in this set requires a special tool.

• Lead Layouts

surface

 

MZ-B100

zWaveforms

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.3Vp-p

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.56 sec

 

 

 

 

 

 

 

 

 

 

 

 

 

IC601

4

 

VOLT/DIV : 0.5 V AC

 

 

 

XIN

 

 

 

 

 

 

 

 

 

TIME/DIV : 0.1sec

2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.3Vp-p

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.56

sec

 

 

 

 

 

 

 

 

 

 

 

 

 

IC901

th

VOLT/DIV : 0.5 V AC

 

 

CLK

 

 

 

TIME/DIV : 0.1sec

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.2Vp

 

-p

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

45.1584MHz

IC801

wg

VOLT/DIV :0.5 V AC

 

 

OSCO

TIME/DIV : 20 nsec

Lead layout of conventional IC

CSP (chip size package)

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Sony MZ-B100 specifications 0.56 sec, 45.1584MHz, zWaveforms, IC601, 2.3Vp-p, IC901, IC801, Osco