MZ-DH10P

Ver. 1.2

•Note For Printed Wiring Boards and Schematic Diagrams

Note on Printed Wiring Board:

•X : parts extracted from the component side.

•Y : parts extracted from the conductor side.

•z : Through hole.

•f : internal component.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:

 

Pattern face side:

Parts on the pattern face side seen from

(Conductor Side)

the pattern face are indicated.

Parts face side:

Parts on the parts face side seen from

(Component Side)

the parts face are indicated.

 

 

 

 

Caution:

 

Pattern face side:

Parts on the pattern face side seen from

(Side B)

the pattern face are indicated.

Parts face side:

Parts on the parts face side seen from

(Side A)

the parts face are indicated.

 

 

* Replacement of IC401, IC501, IC601, IC801 and IC802 used in this set requires a special tool.

•MAIN board is multi-layer printed board.

However, the patterns of intermediate-layer have not been in- cluded in this diagrams.

•Lead Layouts

surface

Lead layout of conventional IC

CSP (chip size package)

 

Note on Schematic Diagram:

•All capacitors are in ∝F unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•f : internal component.

•C : panel designation.

Note: The components identified by mark 0 or dotted line with mark 0 are critical for safety.

Replace only with part number specified.

•A : B+ Line.

•Power voltage is dc 3.7 V and fed with regulated dc power supply from rechargeable battery terminal.

•Voltages and waveforms are dc with respect to ground under no-signal conditions.

no mark : PLAYBACK

[

] : PLAYBACK (SERVO OFF)

(

) : PLAYBACK (SERVO ON)

∗: Impossible to measure

•Voltages are taken with a VOM (Input impedance 10 MΩ ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

E : PLAYBACK

j : REC

d : USB input from PC

G : USB output to PC

*Replacement of IC401, IC501, IC601, IC801 and IC802 used in this set requires a special tool.

•The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.

•Waveforms

– MAIN Board –

1

 

IC701 1

(VI1), 2 (WI1),

7 IC501 wh (CLK) (Servo on)

 

 

 

th

(UI1) (Servo on)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.2 Vp-p

 

 

3 Vp-p

 

 

 

7.6 ms

 

 

 

 

 

 

 

 

 

88 ns

 

 

 

1 V/DIV, 5 ms/DIV

1 V/DIV, 50 ns/DIV

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2 IC701 tg (PWM1) (Servo on)

8 IC901 yd (CLK)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.5 Vp-p

2.7 Vp-p

 

11.3 ∝s

 

5.7 ∝s

 

1 V/DIV, 5 ∝s/DIV

1 V/DIV, 5 ∝s/DIV

 

 

 

 

 

 

 

 

3 IC501 1 (IX) (Servo on)

9 IC351 wd (MCK)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.8 Vp-p

190 mVp-p

44.3 ns

 

50 mV/DIV, 200 ns/DIV

1 V/DIV, 20 ns/DIV

4 IC501 8 (RFO) (Servo on)

q; IC871 8 (OSCOUT)

1.2 Vp-p

1 Vp-p

∝

 

30.5 s

500 mV/DIV, 100 ns/DIV

500 mV/DIV, 10 ∝s/DIV

5 IC501 ra (FE) (Servo on)

qa IC801 <czz (OSCO)

Approx.

 

 

2.7 Vp-p

60 mVp-p

 

44.3 ns

 

20 mV/DIV, 1 ∝s/DIV

1 V/DIV, 20 ns/DIV

6IC501 rs (TE) (Servo on)

Approx. 350 mVp-p

100 mV/DIV, 1 ∝s/DIV

MZ-DH10P

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