CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.
On power sources
•Use house curre nt, nikel metal hyd ride rechargeable battery, LR6 (S G) battery, or car
battery.
• For use in your house: For the s uppl ied battery charging s ta nd, use the AC power adaptor
s uppl ied with this recorder. Do not use an y other AC power adaptor s ince it ma y cause the recorder to malfuncti on.
Polarity of the plug
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.
•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead- free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about 350 ˚C .
Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
| TABLE OF CONTENTS |
|
1. | SERVICING NOTES | 4 |
2. | GENERAL | 5 |
3.DISASSEMBLY
Disassembly Flow | 6 | |
Bottom Panel Assy | 7 | |
Upper Panel Section | 7 | |
LCD Module, Upper Panel Assy | 8 | |
MAIN Board Section | 8 | |
Battery Case Assy, MAIN Board | 9 | |
MD Mechanism Deck |
| |
| Chassis Assy | 9 |
OP Service Assy | 10 | |
Holder Assy | 11 | |
11 | ||
| ||
| DC Motor (Over Write Head UP/DOWN) (M603) | 12 |
4. | TEST MODE | 13 |
5. | ELECTRICAL ADJUSTMENTS | 19 |
6.DIAGRAMS
Block Diagram – SERVO/USB Section | 30 | |
Block Diagram – AUDIO Section | 31 | |
Block Diagram – DISPLAY/KEY CONTROL/ |
| |
| POWER SUPPLY Section | 32 |
Note for Printed Wiring Board and |
| |
| Schematic Diagrams | 33 |
Printed Wiring Board |
| |
| – MAIN Board (Component Side) | 34 |
Printed Wiring Board |
| |
| – MAIN Board (Conductor Side) | 35 |
Schematic Diagram – MAIN Board (1/4) | 36 | |
Schematic Diagram – MAIN Board (2/4) | 37 | |
Schematic Diagram – MAIN Board (3/4) | 38 | |
Schematic Diagram – MAIN Board (4/4) | 39 | |
46 |
7.EXPLODED VIEWS
Upper Panel Section | 53 | |
Bottom Panel Section | 54 | |
Chassis Section | 55 | |
Main Board Section | 56 | |
57 | ||
8. | ELECTRICAL PARTS LIST | 58 |
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