TDK iFA Series manual 11/18

Advance Data Sheet: MaxetaTM iFA Series

Performance page for the power module of interest. In all conditions, the power module should be operated below the maximum operating temperature shown on

the derating curve. For improved design margins and enhanced system reliability, the power module may be operated at temperatures below the maximum rated operating temperature.

Heat transfer by convection can be enhanced by increasing the airflow rate that the power module experiences. The maximum output current of the power module is a function of ambient temperature

(TAMB) and airflow rate as shown in the thermal performance figures in the Thermal

Performance section. The curves in the figures are shown for natural convection through 3 m/s (600 ft/min). The data for the natural convection condition has been collected at 0.3 m/s (60 ft/min) of airflow, which is the typical airflow generated by other heat dissipating components in many of the systems that these types of modules are used in. In the final system configurations, the airflow rate for the natural convection condition can vary due to temperature gradients from other heat dissipating components.

Heatsink Usage: For applications with demanding environmental requirements, such as higher ambient temperatures or higher power dissipation, the thermal performance of the power module can be improved by attaching a heatsink or cold plate. The iFA platform is designed with a base plate with four M3 X 0.5 through- threaded mounting fillings for attaching a heatsink or cold plate. A non-threaded version is also available. The addition of a heatsink can reduce the airflow requirement, ensure consistent operation and extended reliability of the system. With improved thermal performance, more power can be delivered at a given environmental condition.

Standard heatsink kits are available from TDK Innoveta for vertical module mounting in two different orientations (longitudinal – perpendicular to the direction of the pins and transverse – parallel to the direction of the

pins) as shown in the Heatsink Offering section. The heatsink kit contains four M3 x

0.5steel mounting screws and a precut thermal interface pad for improved thermal resistance between the power module and the heatsink. The screws should be installed using a torque-limiting driver set between 0.35-0.55 Nm (3-5 in-lbs).

During heatsink assembly, the base-plate to heatsink interface must be carefully managed. A thermal pad may be required to reduce mechanical-assembly-related stresses and improve the thermal connection. Please contact TDK Innoveta Engineering for recommendation on this subject.

The system designer must use an accurate estimate or actual measure of the internal airflow rate and temperature when doing the heatsink thermal analysis. For each application, a review of the heatsink fin orientation should be completed to verify proper fin alignment with airflow direction to maximize the heatsink effectiveness. For TDK Innoveta standard heatsinks, contact TDK Innoveta Inc. for latest performance data.

©2005 TDK Innoveta Inc.		￿ (877) 498-0099
iFA Advance Datasheet	6/6/2005	11/18