Telit Wireless Solutions manual 12.1.8 GE864 Solder reflow

GE864 Hardware User Guide

1vv0300694 Rev.10 - 10/06/08

12.1.8 GE864 Solder reflow

The following is the recommended solder reflow profile

Profile Feature	Pb-Free Assembly
Average ramp-up rate (TL to TP)	3°C/second max
Preheat

8Temperature Min (Tsmin) 150°C

8Temperature Max 200°C

(Tsmax)	60-180 seconds
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate	3°C/second max
Time maintained above:
8 Temperature (TL)	217°C
– Time (tL)	60-150 seconds
Peak Temperature (Tp)	245 +0/-5°C
Time within 5°C of actual Peak	10-30 seconds
Temperature (tp)
Ramp-down Rate	6°C/second max.
Time 25°C to Peak Temperature	8 minutes max.

NOTE: All temperatures refer to topside of the package, measured on the package body surface.

NOTE: GE864 module can accept only one reflow process

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