Telit Wireless Solutions GE864 PCB pad design, Ball pitch mm Solder resist opening diameter a mm

Models: GE864

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GE864 Hardware User Guide

1vv0300694 Rev.10 - 10/06/08

12.1.6 PCB pad design

Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.

Recommendations for PCB pad dimensions

 

 

 

 

 

 

 

Ball pitch [mm]

2,5

 

Solder resist opening diameter A [mm]

 

1,150

 

Metal pad diameter B [mm]

 

1 ± 0.05

Placement of microvias not covered by solder resist is not recommended inside the “Solder resist opening”, unless the microvia carry the same signal of the pad itself.

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page 62 of 69

Page 62
Image 62
Telit Wireless Solutions GE864 PCB pad design, Ball pitch mm Solder resist opening diameter a mm, Metal pad diameter B mm