Intel Core 2, GME965 user manual Backplate Pins

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Hardware Reference

Figure 10. Backplate Pins

4.Clean the die of the processor with isopropyl alcohol before the heatsink is attached to the processor. This ensures that the surface of the die is clean.

5.Remove the tube of thermal grease from the package and use it to coat the exposed die of the CPU with the thermal grease.

316704-001 / Development Kit User’s Manual

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Contents June 316704-001 / Development Kit User’s Manual Contents Tables FiguresInitial public release June Document Revision Description Revision DateText Conventions Content OverviewNotation Definition Text ConventionsGlossary of Terms and Acronyms Terms and AcronymsTerm/Acronym Definition Experience under all conditions Acronym Definition AcronymsBios LOM Intel Literature Centers Support OptionsProduct Literature Electronic Support Systems Additional Technical SupportRelated Documents Related DocumentsDocument Title Location Development Board Comments Implementation Development Board FeaturesDevelopment Board feature Set Summary OverviewUSB Included Hardware and Documentation Software Key FeaturesBefore You Begin AMI BiosGetting Started Setting Up the Development Board Configuring the Bios Mechanical Form Factor Block DiagramSystem Features and Operation Thermal ManagementMobile Intel GME965 Gmch System Memory 1.2 DMIAdvanced Graphics and Display Interfaces PCI Slots 2 ICH8-MPCI Express x16 Slot PCI Express* Slots2.5 ATA/ Storage USB ConnectorsOn-Board LAN High Definition Audio2.10 SPI Bios Firmware Hub FWHLPC Super I/O SIO/LPC Slot Serial, IrDAReal Time Clock Bios Location Strapping OptionsSystem Management Controller SMC/Keyboard Controller ClocksPost Code Debugger Power Management StatesPower Management States Clock GenerationManageability Subsystem2 Power Management M-StatesDescription Main Memory State Subsystem1Power Measurement Support Sleep Signals and M-State DefinitionSignal Development Board Voltage Rails Component Voltage Supply Rail Reference LAN +V3.3MLANSW VDDCK505 ATX Development Board Component Locations Primary FeaturesReference Function Development Board Component Location LegendJ8D1 Back Panel ConnectorsDescription Ref Des TV-Out D-ConnectorConnector to Component Video Cable Configuration SettingsReference Function Default Setting Optional Setting For each VID signal J7J2 NMI Power On and Reset ButtonsFunction Reference LEDs1 H8 Programming Headers Other Headers, Slots and SocketsExpansion Slots and Sockets Expansion Slots and SocketsReference Slot/Socket Description Detail Designator Reference Slot/Socket Description Detail 2.1 478 Pin Grid Array Micro-FCPGA SocketPCI Express PCI Express* x16 Pinout J6B2PERST# PRSNT#2 ADD2 Slot J6B2 2.3 ADD2/Media Expansion Card MEC SlotEnd of x1 Connector A19 Reserved B19 SDVOGreen+ A20 A50 Reserved B50 A51 MEC Slot J6B2 SDVOCCLK+ PCI Express* x1 Pinout J6B1, J7B1, J8B4 IDE Connector IDE ConnectorPin Signal Sata Pinout Fan ConnectorsSata Port 0 ‘Direct Connect’ Connector Pinout J8J1 Sata Power Connection J7H2Pin Signal Definition Fan Connectors J2B3, J2C1Fan Connector J2F1 Front Panel ConnectorUSB Headers USB Headers J6H3, J6H4Appendix a . Heatsink Installation Instructions Backplate Pins Applying the Thermal Grease Installing the Heatsink Plugging in the Fan