Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset Installing the Heatsink

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Hardware Reference

7.While keeping the activation arm compressed, place the heatsink over the pins of the heatsink backplate. Lower the heatsink until the lugs have inserted into the base of the heatsink. Slide the heatsink over the lugs on the backplate pins so that the base is directly over the processor die and the pins on the backplate have travelled the entire length of the channel in the heatsink base. Slowly let go of the activation arm until the base of the heatsink makes contact with the processor die. The heatsink base should be flat on top of the processor die.

Figure 13. Installing the Heatsink

8.Plug the fan connector for the heatsink onto the CPU fan header (J2B3) on the motherboard.

Note: The CPU fan header (J2B3) is a 3-pin connector. This is a change from the Mobile Intel® 945GM Express Chipset Development Kit which has a 2-pin CPU fan header. As a result, it is not possible to use the heatsink from the Intel® 945GM Express Chipset Development Kit even though the heatsink and backplate are mechanically compatible.

316704-001 / Development Kit User’s Manual

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Contents June 316704-001 / Development Kit User’s Manual Contents Tables FiguresInitial public release June Document Revision Description Revision DateText Conventions Content OverviewNotation Definition Text ConventionsTerm/Acronym Definition Glossary of Terms and AcronymsTerms and Acronyms Experience under all conditions Acronym Definition AcronymsBios LOM Product Literature Support OptionsElectronic Support Systems Additional Technical Support Intel Literature CentersDocument Title Location Related DocumentsRelated Documents Development Board feature Set Summary Development Board FeaturesOverview Development Board Comments ImplementationUSB Included Hardware and Documentation Software Key FeaturesBefore You Begin AMI BiosGetting Started Setting Up the Development Board Configuring the Bios Mechanical Form Factor Block DiagramMobile Intel GME965 Gmch System Features and OperationThermal Management Advanced Graphics and Display Interfaces System Memory1.2 DMI PCI Express x16 Slot 2 ICH8-MPCI Express* Slots PCI SlotsOn-Board LAN USB ConnectorsHigh Definition Audio 2.5 ATA/ StorageLPC Super I/O SIO/LPC Slot Bios Firmware Hub FWHSerial, IrDA 2.10 SPISystem Management Controller SMC/Keyboard Controller Bios Location Strapping OptionsClocks Real Time ClockPower Management States Power Management StatesClock Generation Post Code DebuggerDescription Main Memory State Power Management M-StatesSubsystem1 Manageability Subsystem2Signal Power Measurement SupportSleep Signals and M-State Definition Development Board Voltage Rails Component Voltage Supply Rail Reference LAN +V3.3MLANSW VDDCK505 ATX Development Board Component Locations Primary FeaturesReference Function Development Board Component Location LegendJ8D1 Back Panel ConnectorsDescription Ref Des TV-Out D-ConnectorConnector to Component Video Cable Configuration SettingsReference Function Default Setting Optional Setting For each VID signal J7J2 NMI Power On and Reset ButtonsFunction Reference LEDs1 H8 Programming Headers Other Headers, Slots and SocketsReference Slot/Socket Description Detail Designator Expansion Slots and SocketsExpansion Slots and Sockets PCI Express 2.1 478 Pin Grid Array Micro-FCPGA SocketPCI Express* x16 Pinout J6B2 Reference Slot/Socket Description DetailPERST# PRSNT#2 ADD2 Slot J6B2 2.3 ADD2/Media Expansion Card MEC SlotEnd of x1 Connector A19 Reserved B19 SDVOGreen+ A20 A50 Reserved B50 A51 MEC Slot J6B2 SDVOCCLK+ PCI Express* x1 Pinout J6B1, J7B1, J8B4 Pin Signal IDE ConnectorIDE Connector Sata Port 0 ‘Direct Connect’ Connector Pinout J8J1 Fan ConnectorsSata Power Connection J7H2 Sata PinoutFan Connector J2F1 Fan Connectors J2B3, J2C1Front Panel Connector Pin Signal DefinitionUSB Headers USB Headers J6H3, J6H4Appendix a . Heatsink Installation Instructions Backplate Pins Applying the Thermal Grease Installing the Heatsink Plugging in the Fan