Fujitsu D1562, D1561 technical manual Mounting heat sink

Replacing processor

Mounting heat sink

Be sure to use heat conducting material between the processor and the heat sink. If a heat conducting pad (rubber-like foil) is already applied to the heat sink, then use it. Otherwise you must apply a very thin layer of heat conducting paste.

Heat conducting pads can only be used once. If you remove the heat sink, you must clean it and apply new heat conducting paste before you remount it.

Please note that, depending on the heat sink used, different heat sink mounts are required on the mainboard.

If a counter-plate is mounted on the underside of the mainboard for reinforcement, no

i heat sinks of the type "Intel Boxed" may be used. Otherwise the retaining clips of the heat sink will be damaged.

When using an "Intel Boxed" heat sink, the mainboard must be converted. This conversion set is either included with the mainboard or is available separately.

If no counter-plate is mounted, you can use both "Intel Boxed" heat sinks and standard heat sinks. If you use the "Intel Boxed" heat sink, the mainboard will bend due to the high pressure of the retaining clips. This behaviour is specified by Intel.

Ê Depending on the configuration variant, you must pull a protective foil off the heat sink or coat the heat sink with heat conducting paste before fitting it.

Ê Depending on the processor variant, clips may also be supplied for mounting the heat sink that fix it in place.

Ê When you have mounted the optional fan, connect the fan plug to the corresponding connection on the mainboard.

A26361-D1562-Z120-2-6319 English - 19