Cypress CY62137FV30 Document History, REV ECN no, Issue Orig. Date Change Description of Change

Page 12

CY62137FV30 MoBL®

Document History Page

Document Title: CY62137FV30 MoBL® 2-Mbit (128K x 16) Static RAM

Document Number: 001-07141

REV.

ECN NO.

Issue

Orig. of

 

Date

Change

Description of Change

 

 

 

 

 

 

 

**

449438

See ECN

NXR

New datasheet

 

 

 

 

 

*A

464509

See ECN

NXR

Changed the ISB2(typ) value from 1.0 μA to 0.5 μA

 

 

 

 

Changed the ISB2(max) value from 4 μA to 2.5 μA

 

 

 

 

Changed the ICC(typ) value from 2 mA to 1.6 mA and ICC(max) value from

 

 

 

 

2.5 mA to 2.25 mA for f=1 MHz test condition

 

 

 

 

Changed the ICC(typ) value from 15 mA to 13 mA and ICC(max) value from

 

 

 

 

20 mA to 18 mA for f=1 MHz test condition

 

 

 

 

Changed the ICCDR(typ) value from 0.7 μA to 0.5 μA and ICCDR(max) value from 3 μA to

 

 

 

 

2.5 μA

*B

566724

See ECN

NXR

Converted from preliminary to final

 

 

 

 

Changed the ICC(max) value from 2.25 mA to 2.5 mA for test condition f=1 MHz

 

 

 

 

Changed the ISB2(typ) value from 0.5 μA to 1 μA

 

 

 

 

Changed the ISB2(max) value from 2.5 μA to 5 μA

 

 

 

 

Changed the ICCDR(typ) value from 0.5 μA to 1 μA and ICCDR(max) value from 2.5 μA to

 

 

 

 

4 μA

*C

869500

See ECN

VKN

Added Automotive-A and Automotive-E information

 

 

 

 

Updated Ordering Information Table

 

 

 

 

Added footnote 13 related to tACE

*D

901800

See ECN

VKN

Added footnote 9 related to ISB2 and ICCDR

 

 

 

 

Made footnote 14 applicable to AC parameters from tACE

*E

1371124

See ECN

VKN/AESA

Converted Automotive information from preliminary to final

 

 

 

 

Changed IIX min spec from –1 μA to –4 μA and IIX max spec from +1 μA to +4 μA

 

 

 

 

Changed IOZ min spec from –1 μA to –4 μA and IOZ max spec from +1 μA to +4 μA

*F

1875374

See ECN

VKN/AESA

Added -45BVI part in the Ordering Information table

 

 

 

 

 

© Cypress Semiconductor Corporation, 2006-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress.

Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

Use may be limited by and subject to the applicable Cypress software license agreement.

Document Number: 001-07141 Rev. *FRevised January 2, 2008Page 12 of 12

MoBL is a registered trademark and More Battery Life is a trademark of Cypress Semiconductor. All product and company names mentioned in this document are the trademarks of their respective holders.

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Contents Features Logic Block DiagramFunctional Description Cypress Semiconductor Corporation 198 Champion CourtPin Configuration Product PortfolioMin Max TypElectrical Characteristics Maximum RatingsCapacitance Device Range AmbientData Retention Characteristics Thermal ResistanceAC Test Loads and Waveforms Data Retention WaveformSwitching Characteristics Switching Waveforms AddressData OUT Previous Data Valid Write Cycle 1 WE Controlled 16, 20 Write Cycle 2 CE Controlled 16, 20Write Cycle 3 WE Controlled, OE LOW Inputs or Outputs Mode Power Truth TableBHE BLE Package Diagram CY62137FV30LL-45BVI 51-85150 Ball VfbgaPin Tsop Issue Orig. Date Change Description of Change Document HistoryREV ECN no

CY62137FV30 specifications

The Cypress CY62137FV30 is a high-performance SRAM (Static Random Access Memory) device designed for high-speed applications. It features a 4-Mbit memory capacity organized into a 512K x 8-bit configuration, making it suitable for a wide range of embedded systems, computing, and communication applications.

One of the standout features of the CY62137FV30 is its fast access time, with speeds as low as 30 ns. This rapid response capability is essential for applications requiring fast data retrieval, such as telecommunications equipment, automotive systems, and consumer electronics where performance is critical. The device also supports a wide operating voltage range from 2.7V to 3.6V, providing flexibility for use in various power-sensitive applications.

In terms of packaging, the CY62137FV30 is available in compact form factors, allowing for designs with space constraints. It comes in standard packages such as TSOPII and SOJ, which are well-regarded in the industry for ease of integration into circuit boards.

The CY62137FV30 employs advanced CMOS technology, ensuring low power consumption while maintaining high-speed performance. This is particularly beneficial in battery-operated devices where power efficiency is a priority. The device offers both read and write cycles, allowing for seamless data operations. Additionally, the SRAM architecture supports asynchronous operations, allowing users to access memory without the need for a clock signal.

The memory is designed with built-in write protection features, enhancing data integrity during critical operations. It is compatible with various standard memory interfaces, making it easy to integrate into different system architectures. Moreover, the device can endure a significant number of read and write cycles, ensuring durability and reliability over extended use.

The CY62137FV30 also features a simple interface, with easy-to-use control signals, which facilitate straightforward integration and design flexibility. Its ability to handle dynamic data and provide quick access to stored information makes it an excellent choice for applications like networking equipment, industrial automation, and high-performance computing systems.

In summary, the Cypress CY62137FV30 is a versatile SRAM solution that combines high speed, low power consumption, and compact packaging. Its innovative technology and reliable performance make it an excellent choice for various applications requiring efficient and fast memory solutions.