Cypress CY7C1350G manual Switching Characteristics Over the Operating Range17

Page 9

CY7C1350G

Switching Characteristics Over the Operating Range[17, 18]

 

 

 

 

 

 

 

 

 

 

 

–250

–200

–166

–133

–100

 

Parameter

 

 

 

 

 

 

 

 

 

Description

 

 

 

 

 

 

 

 

 

Unit

 

 

 

 

 

 

 

 

 

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tPOWER

 

VDD (typical) to the first Access[13]

1

 

1

 

1

 

1

 

1

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

5.0

 

6.0

 

7.5

 

10

 

ns

tCH

 

Clock HIGH

1.7

 

2.0

 

2.5

 

3.0

 

3.5

 

ns

tCL

 

Clock LOW

1.7

 

2.0

 

2.5

 

3.0

 

3.5

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid After CLK Rise

 

2.6

 

2.8

 

3.5

 

4.0

 

4.5

ns

tDOH

 

Data Output Hold After CLK Rise

1.0

 

1.0

 

1.5

 

1.5

 

1.5

 

ns

tCLZ

 

Clock to Low-Z[14, 15, 16]

0

 

0

 

0

 

0

 

0

 

ns

tCHZ

 

Clock to High-Z[14, 15, 16]

 

2.6

 

2.8

 

3.5

 

4.0

 

4.5

ns

tOEV

 

 

 

LOW to Output Valid

 

2.6

 

2.8

 

3.5

 

4.0

 

4.5

ns

OE

tOELZ

 

 

 

LOW to Output Low-Z[14, 15, 16]

0

 

0

 

0

 

0

 

0

 

ns

OE

tOEHZ

 

 

 

HIGH to Output High-Z[14, 15,

 

2.6

 

2.8

 

3.5

 

4.0

 

4.5

ns

OE

 

 

16]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Set-up Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Set-up Before CLK Rise

1.2

 

1.2

 

1.5

 

1.5

 

1.5

 

ns

tALS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

 

 

Set-up Before CLK Rise

1.2

 

1.2

 

1.5

 

1.5

 

1.5

 

ns

tWES

 

 

 

 

 

 

 

 

X Set-Up Before CLK Rise

1.2

 

1.2

 

1.5

 

1.5

 

1.5

 

ns

GW,

BW

tCENS

 

 

 

 

 

Set-up Before CLK Rise

1.2

 

1.2

 

1.5

 

1.5

 

1.5

 

ns

CEN

tDS

 

Data Input Set-up Before CLK Rise

1.2

 

1.2

 

1.5

 

1.5

 

1.5

 

ns

tCES

 

Chip Enable Set-Up Before CLK

1.2

 

1.2

 

1.5

 

1.5

 

1.5

 

ns

 

 

Rise

 

 

 

 

 

 

 

 

 

 

 

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold After CLK Rise

0.3

 

0.5

 

0.5

 

0.5

 

0.5

 

ns

tALH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

 

Hold after CLK Rise

0.3

 

0.5

 

0.5

 

0.5

 

0.5

 

ns

tWEH

 

 

 

 

 

 

 

X Hold After CLK Rise

0.3

 

0.5

 

0.5

 

0.5

 

0.5

 

ns

GW,

BW

tCENH

 

 

 

 

Hold After CLK Rise

0.3

 

0.5

 

0.5

 

0.5

 

0.5

 

ns

CEN

tDH

 

Data Input Hold After CLK Rise

0.3

 

0.5

 

0.5

 

0.5

 

0.5

 

ns

tCEH

 

Chip Enable Hold After CLK Rise

0.3

 

0.5

 

0.5

 

0.5

 

0.5

 

ns

Notes:

13.This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD minimum initially before a Read or Write operation can be initiated.

14.tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.

15.At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve tri-state prior to Low-Z under the same system conditions.

16.This parameter is sampled and not 100% tested.

17.Timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V.

18.Test conditions shown in (a) of AC Test Loads unless otherwise noted.

Document #: 38-05524 Rev. *F

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Contents Logic Block Diagram FeaturesCypress Semiconductor Corporation Champion Court San Jose , CA Document # 38-05524 Rev. *FSelection Guide Pin ConfigurationsCY7C1350G 250 MHz 200 MHz 166 MHz 133 MHz 100 MHz UnitPin Definitions Pin Configurations Ball BGA PinoutName Description Byte Write Inputs, active LOW . Qualified withFunctional Overview Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDPartial Truth Table for Read/Write 2, 3 ZZ Mode Electrical CharacteristicsOperation Address Used FunctionMaximum Ratings Electrical Characteristics Over the Operating Range10Operating Range Ambient RangeThermal Resistance Capacitance12AC Test Loads and Waveforms Parameter Description Test Conditions Tqfp 119 BGA Unit MaxSwitching Characteristics Over the Operating Range17 Read/Write Timing19, 20 Switching WaveformsCEN Address A1 A2NOP, STALL, and Deselect Cycles19, 20 ZZ Mode Timing23Ordering Information Pin Tqfp 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Document History Issue Orig. Description of Change Date