Cypress CY7C1350G manual Package Diagrams, Pin Tqfp 14 x 20 x 1.4 mm

Page 13

CY7C1350G

Package Diagrams

100-Pin TQFP (14 x 20 x 1.4 mm) (51-85050)

16.00±0.20

14.00±0.10

1.40±0.05

100	81
1	80

22.00±0.20

20.00±0.10

30

31

0.30±0.08

0.65	12° ±1°
TYP.	(8X)

51

50

SEE DETAIL

A

0.20 MAX.

1.60 MAX.

R 0.08 MIN. 0.20 MAX.

0.25

0° MIN.

SEATING PLANE

STAND-OFF

0.05 MIN.NOTE:

0.15 MAX.

0.10

GAUGE PLANE

0° -7°

0.60±0.15

1.00 REF.

R 0.08 MIN. 0.20 MAX.

0.20 MIN.

DETAIL A

1.JEDEC STD REF MS-026

2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH

3.DIMENSIONS IN MILLIMETERS

51-85050-*B

Document #: 38-05524 Rev. *F

Page 13 of 15

[+] Feedback

Image 13

Contents Logic Block Diagram FeaturesCypress Semiconductor Corporation Champion Court San Jose , CA Document # 38-05524 Rev. *FSelection Guide Pin ConfigurationsCY7C1350G 250 MHz 200 MHz 166 MHz 133 MHz 100 MHz UnitPin Definitions Pin Configurations Ball BGA PinoutName Description Byte Write Inputs, active LOW . Qualified withFunctional Overview Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDPartial Truth Table for Read/Write 2, 3 ZZ Mode Electrical CharacteristicsOperation Address Used FunctionMaximum Ratings Electrical Characteristics Over the Operating Range10Operating Range Ambient RangeThermal Resistance Capacitance12AC Test Loads and Waveforms Parameter Description Test Conditions Tqfp 119 BGA Unit MaxSwitching Characteristics Over the Operating Range17 Read/Write Timing19, 20 Switching WaveformsCEN Address A1 A2NOP, STALL, and Deselect Cycles19, 20 ZZ Mode Timing23Ordering Information Pin Tqfp 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Document History Issue Orig. Description of Change Date