Cypress CY62167EV30 manual Document History, REV ECN no

Page 13

CY62167EV30 MoBL®

Document History Page

Document Title: CY62167EV30 MoBL® 16-Mbit (1M x 16 / 2M x 8) Static RAM

Document Number: 38-05446

REV.

ECN NO.

Orig. of

Submission

 

Change

Date

Description of Change

 

 

 

 

 

 

 

**

202600

AJU

01/23/2004

New Data Sheet

 

 

 

 

 

*A

463674

NXR

See ECN

Converted from Advance Information to Preliminary

 

 

 

 

Removed ‘L’ bin and 35 ns speed bin from product offering

 

 

 

 

Modified Data sheet to include x8 configurability.

 

 

 

 

Changed ball E3 in FBGA pinout from DNU to NC

 

 

 

 

Changed the ISB2(Typ) value from 1.3 μA to 1.5 μA

 

 

 

 

Changed the ICC(Max) value from 40 mA to 25 mA

 

 

 

 

Changed Vcc stabilization time in footnote #9 from 100 µs to 200 µs

 

 

 

 

Changed the AC Test Load Capacitance value from 50 pF to 30 pF

 

 

 

 

Corrected typo in Data Retention Characteristics (tR) from 100 µs to tRC ns

 

 

 

 

Changed tOHA, tLZCE, tLZBE, and tLZWE from 6 ns to 10 ns

 

 

 

 

Changed tLZOE from 3 ns to 5 ns.

 

 

 

 

Changed tHZOE, tHZCE, tHZBE, and tHZWE from 15 ns to 18 ns

 

 

 

 

Changed tSCE, tAW, and tBW from 40 ns to 35 ns

 

 

 

 

Changed tPE from 30 ns to 35 ns

 

 

 

 

Changed tSD from 20 ns to 25 ns

 

 

 

 

Updated 48 ball FBGA Package Information.

 

 

 

 

Updated the Ordering Information table

*B

469169

NSI

See ECN

Minor Change: Moved to external web

 

 

 

 

 

*C

1130323

VKN

See ECN

Converted from preliminary to final

 

 

 

 

Changed ICC max spec from 2.8 mA to 4.0 mA for f=1MHz

 

 

 

 

Changed ICC typ spec from 22 mA to 25 mA for f=fmax

 

 

 

 

Changed ICC max spec from 25 mA to 30 mA for f=fmax

 

 

 

 

Added VIL spec for TSOP I package and footnote# 9

 

 

 

 

Added footnote# 10 related to ISB2 and ICCDR

 

 

 

 

Changed ISB1 and ISB2 spec from 8.5 μA to 12 μA

 

 

 

 

Changed ICCDR spec from 8 μA to 10 μA

 

 

 

 

Added footnote# 15 related to AC timing parameters

*D

1323984

VKN/AESA

See ECN

Modified ICCDR spec for TSOP I package

 

 

 

 

Added 48-Ball VFBGA (6 x 7 x 1mm) package

 

 

 

 

Added footnote# 1 related to VFBGA (6 x 7 x 1mm) package

 

 

 

 

Updated Ordering Information table

*E

2678799

VKN/PYRS

03/25/2009

Added Automotive-A information

 

 

 

 

 

Document #: 38-05446 Rev. *E

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Contents Logic Block Diagram FeaturesFunctional Description Cypress Semiconductor Corporation 198 Champion CourtProduct Portfolio Pin ConfigurationMin Typ5 Max CY62167EV30LL BLE BHEMaximum Ratings Electrical CharacteristicsOperating Range CapacitanceThermal Resistance Data Retention CharacteristicsVfbga Tsop Parameter Description Ns Industrial/Auto-A Unit Min Switching CharacteristicsRead Cycle BHESwitching Waveforms Data I/O Valid Data Shows WE controlled write cycle waveforms.18, 22Shows CE1 or CE2 controlled write cycle waveforms.18, 22 Truth Table Inputs/Outputs Mode PowerCE1 CE2 BHE BLE Ordering Information Package DiagramsBall Vfbga 6 x 8 x 1 mm Pin Tsop I 12 mm x 18.4 mm x 1.0 mm REV ECN no Document HistoryOrig. Submission Change Date Description of Change USB Sales, Solutions, and Legal Information