Cypress manual Pin Configuration, Product Portfolio, Min Typ5 Max CY62167EV30LL, Ble Bhe

CY62167EV30 MoBL®

Pin Configuration

Figure 1. 48-Ball VFBGA (6 x 7 x 1mm) / (6 x 8 x 1mm) Top View [1, 2, 3]

1	2		3		4	5		6
BLE	OE		A0		A1	A2		CE2	A
I/O	BHE		A3		A	CE	1	I/O	B
8					4			0
I/O9	I/O10		A5		A6	I/O1		I/O2	C
V	I/O		A	17	A	I/O		VCC	D
SS		11			7	3
VCC	I/O		NC		A16	I/O		Vss	E
		12				4
I/O14	I/O13		A14		A15	I/O5		I/O6	F
I/O	A	19	A		A13	WE		I/O	G
15				12				7
A18	A8		A9		A10	A11		NC	H
Figure 2. 48-Pin TSOP I Top View [3, 4]

A15	1	48	A16
A14	2	47	BYTE
A13	3	46	Vss
A12	4	45	IO15/A20
A11	5	44	IO7
A10	6	43	IO14
A9	7	42	IO6
A8	8	41	IO13
A19	9	40	IO5
NC	10	39	IO12
WE	11	38	IO4
CE2	12	37	Vcc
NC	13	36	IO11
BHE	14	35	IO3
BLE	15	34	IO10
A18	16	33	IO2
A17	17	32	IO9
A7	18	31	IO1
A6	19	30	IO8
A5	20	29	IO0
A4	21	28	OE
A3	22	27	Vss
A2	23	26	CE	1
A1	24	25	A0

Product Portfolio

Power Dissipation

Product

Range

VCC Range (V)

Speed

Operating ICC (mA)

Standby I

(ns)

f = 1 MHz

f = fmax

(μA)

SB2

Min

Typ[5]

Max

Typ[5]

Max

Typ[5]

Max

Typ[5]

Max

CY62167EV30LL

Industrial/Auto-A

2.2

3.0

3.6

45

2.2

4.0

25

30

1.5

12

Notes

1.The information related to 6 x 7 x 1 mm VFBGA package is preliminary.

2.Ball H6 for the VFBGA package can be used to upgrade to a 32M density.

3.NC pins are not connected on the die.

4.The BYTE pin in the 48-TSOPI package has to be tied to VCC to use the device as a 1M X 16 SRAM. The 48-TSOPI package can also be used as a 2M X 8 SRAM by tying the BYTE signal to VSS. In the 2M x 8 configuration, Pin 45 is A20, while BHE, BLE and IO8 to IO14 pins are not used.

5.Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C.

Document #: 38-05446 Rev. *E Page 2 of 14

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