CY62158EV30 MoBL→
Document History Page
Document Title: CY62158EV30 MoBL→,
Document Number:
REV. | ECN NO. | Issue Date | Orig. of | Description of Change | |
Change | |||||
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** | 270329 | See ECN | PCI | New Data Sheet | |
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*A | 291271 | See ECN | SYT | Converted from Advance Information to Preliminary | |
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| Changed ICCDR from 4 to 4.5 ∝A | |
*B | 444306 | See ECN | NXR | Converted from Preliminary to Final. | |
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| Removed 35 ns speed bin | |
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| Removed “L” bin. | |
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| Removed 44 pin TSOP II package | |
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| Included 48 pin TSOP I package | |
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| Changed the ICC Typ value from 16 mA to 18 mA and ICC max value from 28 | |
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| mA to 25 mA for test condition f = fax = 1/tRC. | |
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| Changed the ICC max value from 2.3 mA to 3 mA for test condition f = 1MHz. | |
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| Changed the ISB1 and ISB2 max value from 4.5 ∝A to 8 ∝A and Typ value from | |
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| 0.9 ∝A to 2 ∝A respectively. | |
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| Updated Thermal Resistance table | |
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| Changed Test Load Capacitance from 50 pF to 30 pF. | |
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| Added Typ value for ICCDR . | |
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| Changed the ICCDR max value from 4.5 ∝A to 5 ∝A | |
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| Corrected tR in Data Retention Characteristics from 100 ∝s to tRC ns | |
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| Changed tLZOE from 3 to 5 | |
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| Changed tLZCE from 6 to 10 | |
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| Changed tHZCE from 22 to 18 | |
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| Changed tPWE from 30 to 35 | |
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| Changed tSD from 22 to 25 | |
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| Changed tLZWE from 6 to 10 | |
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| Updated the ordering Information and replaced the Package Name column with | |
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| Package Diagram. | |
*C | 467052 | See ECN | NXR | Included 44 pin TSOP II package in Product Offering. | |
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| Removed TSOP I package; Added reference to CY62157EV30 TSOP I | |
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| Updated the ordering Information table | |
*D | 1015643 | See ECN | VKN | Added footnote #8 related to ISB2 and ICCDR |
Document #: | Page 11 of 11 |
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