Cypress CY62158EV30 Thermal Resistance9, AC Test Loads and Waveforms, Data Retention Waveform

CY62158EV30 MoBL→

Thermal Resistance[9]

Parameter	Description	Test Conditions	BGA	TSOP II	Unit
ΘJA	Thermal Resistance	Still Air, soldered on a 3 x 4.5 inch,	72	76.88	°C/W
	(Junction to Ambient)	two-layer printed circuit board
ΘJC	Thermal Resistance		8.86	13.52	°C/W
	(Junction to Case)

AC Test Loads and Waveforms

R1

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

	VCC		ALL INPUT PULSES
						90%
		10%	90%
							10%
	GND
R2							Fall time: 1 V/ns
	Rise Time: 1 V/ns
	Equivalent to:	THÉVENIN EQUIVALENT
				RTH
	OUTPUT				VTH

Parameters	2.5V	3.0V	Unit
R1	16667	1103	Ω
R2	15385	1554	Ω
RTH	8000	645	Ω
VTH	1.20	1.75	V

Data Retention Characteristics (Over the Operating Range)

Parameter	Description	Conditions			Min		Typ[4]	Max	Unit
VDR	VCC for Data Retention				1.5				V
ICCDR[8]	Data Retention Current	VCC = 1.5V,		1 > VCC − 0.2V			2	5	∝A
			CE
		or CE2 < 0.2V, VIN > VCC − 0.2V
		or VIN < 0.2V
tCDR[9]	Chip Deselect to Data					0			ns
	Retention Time
t [10]	Operation Recovery				t	RC			ns
R	Time

Data Retention Waveform

VCC

CE1

or

CE2

		DATA RETENTION MODE
			VCC, min
VCC, min		VDR > 1.5V
	tCDR			tR

Note

10. Full Device AC operation requires linear VCC ramp from VDR to VCC(min) > 100 ∝s or stable at VCC(min) > 100 ∝s.

Document #: 38-05578 Rev. *D Page 4 of 11

[+] Feedback