Intel LGA 771 manual Assembled Component and Package Description

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Assembled Component and Package Description

10	LGA 771 Socket Mechanical Design Guide

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Contents LGA771 Socket Mechanical Design GuideLGA 771 Socket Mechanical Design Guide Contents Figures TablesRevision History Revision Description DateLGA 771 Socket Mechanical Design Guide Introduction Document Goals and ScopeTerm Description TerminologyReference Documents Document Intel Order NumberAssembled Component and Package Description Assembled Component and Package Description Attachment Mechanical RequirementsSocket Components Package Installation / Removal Access NameContacts Lot TraceabilitySocket Weight Socket SizePackage/Socket Stackup Height Socket Loading SpecificationsIntel Xeon 5000 Sequence Package and Socket Stackup Height Parameter Board Socket Loading SpecificationsMin Max Unit Thickness Definition of R Mechanical Requirements LGA771 Socket Electrical Requirements Electrical RequirementsCriteria Size Electrical Requirements Environmental Requirements Detailed description of this methodology can be found atUse Conditions Environment Shipping and HandlingSolvent Resistance DurabilityEnvironmental Requirements Mechanical Drawings Drawing Description NumberFigure A-1. LGA Socket Assembly Drawing Sheet 1 Figure A-2. LGA Socket Assembly Drawing Sheet 2 Figure A-3. LGA Socket Assembly Drawing Sheet 3 Figure A-4. LGA Socket Assembly Drawing Sheet 4 Figure A-5. LGA771 Socket Motherboard Footprint Sheet 1 Figure A-6. LGA771 Socket Motherboard Footprint Sheet 2 Figure A-7. LGA771 Socket Motherboard Footprint Sheet 3 Figure A-8. LGA771 Socket Motherboard Footprint Sheet 4 Figure A-9. LGA771 Socket Motherboard Footprint Sheet 5 Figure A-10. LGA771 Socket Motherboard Footprint Sheet 6 Figure A-11. LGA 771 Socket Motherboard Footprint Sheet 7 Figure A-12. LGA 771 Socket Footprint Sheet 1 Figure A-13. LGA 771 Socket Footprint Sheet 2