Intel LGA 771 manual Use Conditions Environment, Shipping and Handling

Environmental Requirements

Table 5-1.	Use Conditions Environment
Use Environment		Speculative Stress	Example	Example	Example
				7 Year stress	10 Year stress
		Condition	Use condition
				equivalent	equivalent
Slow small internal		Temperature Cycle	ΔT = 35 - 44°C	550-930 cycles	780-1345 cycles
gradient changes due to			(solder joint)	Temp Cycle Q	Temp Cycle Q
external ambient				(-25°C to 100°C)	(-25°C to 100°C)
(temperature cycle or
externally heated)
Fast, large gradient on/off
to max operating temp.
(power cycle or internally
heated including power
save features)
High ambient moisture		THB/HAST	T = 25 –30°C	110-220 hrs at 110	145-240 hrs at 110°C
during low-power state			85%RH	°C 85%RH	85%RH
(operating voltage)			(ambient)
High Operating		Bake	T = 95 - 105°C	700 – 2500 hrs at	800 – 3300 hrs at
temperature and short			(contact)	125°C	125°C
duration high temperature
exposures
		Mechanical Shock		Total of 12 drops per	n/a
		System-level		system:
		Unpackaged		2 drops per axis
		Trapezoidal		± direction
		25 g
		velocity change is based on packaged weight
			Non-palletized
		Product Weight (lbs)	Product Velocity
Shipping and Handling			Change* (in/sec)
		< 20 lbs	250
		20 to > 40	225
		40 to > 80	205
		80 to < 100	175
		100 to < 120	145
		120	125
		* Change in velocity is based upon a 0.5
		coefficient of restitution.
		Random Vibration		Total per system:	n/a
		System-level
		Unpackaged		10 minutes per axis
				3 axes
Shipping and Handling		5 Hz to 500 Hz
		2.20 g RMS random
		5 Hz @ .001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope
		up)
		20 Hz to 500 Hz @ 0.01 g2/Hz (flat)
		Random control limit tolerance is ± 3 dB
Note: These reliability requirements are given as examples only based on speculative use condition assumptions.

22 LGA 771 Socket Mechanical Design Guide