Intel manual LGA 771 Socket Mechanical Design Guide

Page 2

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The LGA 771 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Xeon and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

*Other brands and names may be claimed as the property of others. Copyright © 2006, Intel Corporation.

2

LGA 771 Socket Mechanical Design Guide

Page 1 Page 3
Image 2
Page 1 Page 3
Contents LGA771 Socket Mechanical Design GuideLGA 771 Socket Mechanical Design Guide Contents Figures TablesRevision History Revision Description DateLGA 771 Socket Mechanical Design Guide Introduction Document Goals and ScopeTerm Description TerminologyReference Documents Document Intel Order NumberAssembled Component and Package Description Assembled Component and Package Description Socket Components Mechanical RequirementsAttachment Package Installation / Removal Access NameContacts Lot TraceabilitySocket Weight Socket SizeIntel Xeon 5000 Sequence Package and Socket Stackup Height Socket Loading SpecificationsPackage/Socket Stackup Height Min Max Unit Thickness Socket Loading SpecificationsParameter Board Definition of R Mechanical Requirements Criteria Size Electrical RequirementsLGA771 Socket Electrical Requirements Electrical Requirements Environmental Requirements Detailed description of this methodology can be found atUse Conditions Environment Shipping and HandlingSolvent Resistance DurabilityEnvironmental Requirements Mechanical Drawings Drawing Description NumberFigure A-1. LGA Socket Assembly Drawing Sheet 1 Figure A-2. LGA Socket Assembly Drawing Sheet 2 Figure A-3. LGA Socket Assembly Drawing Sheet 3 Figure A-4. LGA Socket Assembly Drawing Sheet 4 Figure A-5. LGA771 Socket Motherboard Footprint Sheet 1 Figure A-6. LGA771 Socket Motherboard Footprint Sheet 2 Figure A-7. LGA771 Socket Motherboard Footprint Sheet 3 Figure A-8. LGA771 Socket Motherboard Footprint Sheet 4 Figure A-9. LGA771 Socket Motherboard Footprint Sheet 5 Figure A-10. LGA771 Socket Motherboard Footprint Sheet 6 Figure A-11. LGA 771 Socket Motherboard Footprint Sheet 7 Figure A-12. LGA 771 Socket Footprint Sheet 1 Figure A-13. LGA 771 Socket Footprint Sheet 2
Top Page Image Contents