Intel LGA 771 manual LGA771 Socket Electrical Requirements, Criteria Size

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Electrical Requirements

4Electrical Requirements

Table 4-1provides the LGA771 Socket electrical requirements.

Socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.

Table 4-1.

LGA771 Socket Electrical Requirements

 

 

 

 

 

 

No

Criteria

Size

Notes

 

 

 

 

 

 

*1

Mated loop

1.17 mm:

The inductance calculated for two contacts, considering one

 

 

inductance, Loop

<3.9 nH

forward conductor and one return conductor. These values

 

 

 

 

must be satisfied at the worst-case height of the socket.

 

 

 

 

 

 

2

Mated partial mutual

NA

The inductance on a conductor due to any single neighboring

 

 

inductance, L

 

conductor.

 

 

 

 

 

 

3

Maximum mutual

<1 pF

The capacitance between two pins/connectors.

 

 

capacitance, C

 

 

 

 

 

 

 

 

4

Socket Average

15.2 mΩ

This value has to be satisfied at all times.

 

 

Contact Resistance

 

The specification listed is at room temperature.

 

 

(EOL)

 

 

 

 

 

 

The socket average resistance target is derived from average

 

 

 

 

of every chain contact resistance, with a chain contact

 

 

 

 

resistance defined as the resistance of each chain minus

 

 

 

 

resistance of shorting bars divided by number of lands in the

 

 

 

 

daisy chain.

 

 

 

 

Socket Contact Resistance: The resistance of the socket

 

 

 

 

contact, including the interface resistance to the package land.

 

 

 

 

 

 

5

Max Chain Contact

28 mΩ

This value has to be satisfied at all times.

 

 

Resistance (EOL)

 

The specification listed is at room temperature.

 

 

 

 

The socket average resistance target is derived from average

 

 

 

 

of every chain contact resistance, with a chain contact

 

 

 

 

resistance defined as the resistance of each chain minus

 

 

 

 

resistance of shorting bars divided by number of lands in the

 

 

 

 

daisy chain.

 

 

 

 

Socket Contact Resistance: The resistance of the socket

 

 

 

 

contact, including the interface resistance to the package land.

 

 

 

 

 

 

6

Bulk Resistance

3 mΩ

The bulk resistance increase per contact from 24°C to 100°C

 

 

Increase

 

 

 

 

 

 

 

 

7

Dielectric Withstand

360 Volts

 

 

 

Voltage

RMS

 

 

 

 

 

 

 

8

Insulation Resistance

800 MΩ

 

 

 

 

 

 

§

LGA 771 Socket Mechanical Design Guide

19

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Contents Mechanical Design Guide LGA771 SocketLGA 771 Socket Mechanical Design Guide Contents Tables FiguresRevision Description Date Revision HistoryLGA 771 Socket Mechanical Design Guide Document Goals and Scope IntroductionDocument Intel Order Number TerminologyReference Documents Term DescriptionAssembled Component and Package Description Assembled Component and Package Description Attachment Mechanical RequirementsSocket Components Name Package Installation / Removal AccessLot Traceability ContactsSocket Size Socket WeightPackage/Socket Stackup Height Socket Loading SpecificationsIntel Xeon 5000 Sequence Package and Socket Stackup Height Parameter Board Socket Loading SpecificationsMin Max Unit Thickness Definition of R Mechanical Requirements LGA771 Socket Electrical Requirements Electrical RequirementsCriteria Size Electrical Requirements Detailed description of this methodology can be found at Environmental RequirementsShipping and Handling Use Conditions EnvironmentDurability Solvent ResistanceEnvironmental Requirements Drawing Description Number Mechanical DrawingsFigure A-1. LGA Socket Assembly Drawing Sheet 1 Figure A-2. LGA Socket Assembly Drawing Sheet 2 Figure A-3. LGA Socket Assembly Drawing Sheet 3 Figure A-4. LGA Socket Assembly Drawing Sheet 4 Figure A-5. LGA771 Socket Motherboard Footprint Sheet 1 Figure A-6. LGA771 Socket Motherboard Footprint Sheet 2 Figure A-7. LGA771 Socket Motherboard Footprint Sheet 3 Figure A-8. LGA771 Socket Motherboard Footprint Sheet 4 Figure A-9. LGA771 Socket Motherboard Footprint Sheet 5 Figure A-10. LGA771 Socket Motherboard Footprint Sheet 6 Figure A-11. LGA 771 Socket Motherboard Footprint Sheet 7 Figure A-12. LGA 771 Socket Footprint Sheet 1 Figure A-13. LGA 771 Socket Footprint Sheet 2