Intel LGA 771 manual Package/Socket Stackup Height, Socket Loading Specifications

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Mechanical Requirements

3.5Package/Socket Stackup Height

Table 3-1provides the stackup height of the processor package and LGA771 socket.

Table 3-1. Intel® Xeon® 5000 Sequence Package and Socket Stackup Height

Processor

Integrated Stackup Height 1 (mm)

From Top of Board to Top of IHS

 

 

 

Dual-Core Intel® Xeon® Processor 5000 Series

7.628 - 8.120

 

 

Dual-Core Intel® Xeon® Processor 5100 Series

7.693 - 8.155

 

 

Quad-Core Intel® Xeon® Processor 5300 Series

7.604 - 8.124

 

 

Notes:

1.Preliminary Guidance. This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in the LGA771 Socket Mechanical Design Guide with its tolerances; (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor datasheet.

Figure 3-1. Cross-sectional view of Package / Socket stackup height1

Notes:

1. Not to scale. Shown for illustrative purposes only.

3.6Socket Loading Specifications

Table 3-2provides dynamic and static load specifications for the LGA771 socket. These mechanical load limits should not be exceeded during heatsink assembly, mechanical stress testing or standard drop and shipping conditions. The heatsink attach solutions must not include continuous stress onto the socket with the exception of a uniform load to maintain the heatsink-to-processor thermal interface. Also, any mechanical system or component testing should not exceed these limits. The socket body should not be used as a mechanical reference or load-bearing surface for thermal or mechanical solutions.

LGA 771 Socket Mechanical Design Guide

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Contents Mechanical Design Guide LGA771 SocketLGA 771 Socket Mechanical Design Guide Contents Tables FiguresRevision Description Date Revision HistoryLGA 771 Socket Mechanical Design Guide Document Goals and Scope IntroductionDocument Intel Order Number TerminologyReference Documents Term DescriptionAssembled Component and Package Description Assembled Component and Package Description Mechanical Requirements AttachmentSocket Components Name Package Installation / Removal AccessLot Traceability ContactsSocket Size Socket WeightSocket Loading Specifications Package/Socket Stackup HeightIntel Xeon 5000 Sequence Package and Socket Stackup Height Socket Loading Specifications Parameter BoardMin Max Unit Thickness Definition of R Mechanical Requirements Electrical Requirements LGA771 Socket Electrical RequirementsCriteria Size Electrical Requirements Detailed description of this methodology can be found at Environmental RequirementsShipping and Handling Use Conditions EnvironmentDurability Solvent ResistanceEnvironmental Requirements Drawing Description Number Mechanical DrawingsFigure A-1. LGA Socket Assembly Drawing Sheet 1 Figure A-2. LGA Socket Assembly Drawing Sheet 2 Figure A-3. LGA Socket Assembly Drawing Sheet 3 Figure A-4. LGA Socket Assembly Drawing Sheet 4 Figure A-5. LGA771 Socket Motherboard Footprint Sheet 1 Figure A-6. LGA771 Socket Motherboard Footprint Sheet 2 Figure A-7. LGA771 Socket Motherboard Footprint Sheet 3 Figure A-8. LGA771 Socket Motherboard Footprint Sheet 4 Figure A-9. LGA771 Socket Motherboard Footprint Sheet 5 Figure A-10. LGA771 Socket Motherboard Footprint Sheet 6 Figure A-11. LGA 771 Socket Motherboard Footprint Sheet 7 Figure A-12. LGA 771 Socket Footprint Sheet 1 Figure A-13. LGA 771 Socket Footprint Sheet 2
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