Intel LGA 771 manual Environmental Requirements

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Environmental Requirements

5Environmental Requirements

Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points.

The reliability targets in this section are based on the expected field use environment for a server product. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 5-1.

Figure 5-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology

Establish the market/ expected use environment for the technology

Freeze stressing requirements and perform additional data turns.

Develop Speculative stress conditions based on historical data, content experts, and literature search.

Perform stressing to validate accelerated stressing assumptions and determine acceleration factors.

A detailed description of this methodology can be found at:

http://developer.intel.com/design/packtech/245162.htm.

The use condition environment definitions provided in Table 5-1are based on speculative use condition assumptions, and are provided as examples only.

LGA 771 Socket Mechanical Design Guide

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Contents Mechanical Design Guide LGA771 SocketLGA 771 Socket Mechanical Design Guide Contents Tables FiguresRevision Description Date Revision HistoryLGA 771 Socket Mechanical Design Guide Document Goals and Scope IntroductionReference Documents TerminologyTerm Description Document Intel Order NumberAssembled Component and Package Description Assembled Component and Package Description Mechanical Requirements AttachmentSocket Components Name Package Installation / Removal AccessLot Traceability ContactsSocket Size Socket WeightSocket Loading Specifications Package/Socket Stackup HeightIntel Xeon 5000 Sequence Package and Socket Stackup Height Socket Loading Specifications Parameter BoardMin Max Unit Thickness Definition of R Mechanical Requirements Electrical Requirements LGA771 Socket Electrical RequirementsCriteria Size Electrical Requirements Detailed description of this methodology can be found at Environmental RequirementsShipping and Handling Use Conditions EnvironmentDurability Solvent ResistanceEnvironmental Requirements Drawing Description Number Mechanical DrawingsFigure A-1. LGA Socket Assembly Drawing Sheet 1 Figure A-2. LGA Socket Assembly Drawing Sheet 2 Figure A-3. LGA Socket Assembly Drawing Sheet 3 Figure A-4. LGA Socket Assembly Drawing Sheet 4 Figure A-5. LGA771 Socket Motherboard Footprint Sheet 1 Figure A-6. LGA771 Socket Motherboard Footprint Sheet 2 Figure A-7. LGA771 Socket Motherboard Footprint Sheet 3 Figure A-8. LGA771 Socket Motherboard Footprint Sheet 4 Figure A-9. LGA771 Socket Motherboard Footprint Sheet 5 Figure A-10. LGA771 Socket Motherboard Footprint Sheet 6 Figure A-11. LGA 771 Socket Motherboard Footprint Sheet 7 Figure A-12. LGA 771 Socket Footprint Sheet 1 Figure A-13. LGA 771 Socket Footprint Sheet 2