Intel LGA 771 manual Assembled Component and Package Description

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Assembled Component and Package Description

2Assembled Component and Package Description

The LGA771 Socket dimensions and characteristics must be compatible with that of the processor package and related assembly components. Processors using Flip-Chip Land Grid Array package technology are targeted to be used with the LGA771 socket.

The assembled component may consist of a cooling solution (heatsink, fan, clips, and retention mechanism), and processor package. The processor Thermal/Mechanical Design Guidelines (TMDG) provides information for designing components compliant with the Intel reference design.

Relevant processor 771-Land LGA package and pin-out information is given in the processor datasheet.

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LGA 771 Socket Mechanical Design Guide

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Contents Mechanical Design Guide LGA771 SocketLGA 771 Socket Mechanical Design Guide Contents Tables FiguresRevision Description Date Revision HistoryLGA 771 Socket Mechanical Design Guide Document Goals and Scope IntroductionReference Documents TerminologyTerm Description Document Intel Order NumberAssembled Component and Package Description Assembled Component and Package Description Mechanical Requirements AttachmentSocket Components Name Package Installation / Removal AccessLot Traceability ContactsSocket Size Socket WeightSocket Loading Specifications Package/Socket Stackup HeightIntel Xeon 5000 Sequence Package and Socket Stackup Height Socket Loading Specifications Parameter BoardMin Max Unit Thickness Definition of R Mechanical Requirements Electrical Requirements LGA771 Socket Electrical RequirementsCriteria Size Electrical Requirements Detailed description of this methodology can be found at Environmental RequirementsShipping and Handling Use Conditions EnvironmentDurability Solvent ResistanceEnvironmental Requirements Drawing Description Number Mechanical DrawingsFigure A-1. LGA Socket Assembly Drawing Sheet 1 Figure A-2. LGA Socket Assembly Drawing Sheet 2 Figure A-3. LGA Socket Assembly Drawing Sheet 3 Figure A-4. LGA Socket Assembly Drawing Sheet 4 Figure A-5. LGA771 Socket Motherboard Footprint Sheet 1 Figure A-6. LGA771 Socket Motherboard Footprint Sheet 2 Figure A-7. LGA771 Socket Motherboard Footprint Sheet 3 Figure A-8. LGA771 Socket Motherboard Footprint Sheet 4 Figure A-9. LGA771 Socket Motherboard Footprint Sheet 5 Figure A-10. LGA771 Socket Motherboard Footprint Sheet 6 Figure A-11. LGA 771 Socket Motherboard Footprint Sheet 7 Figure A-12. LGA 771 Socket Footprint Sheet 1 Figure A-13. LGA 771 Socket Footprint Sheet 2