AG Neovo TSC-30/IC Implementation Temperature Specification, Soldering iron Manual soldering

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TSC-30/IC Product Specification

8. Implementation Temperature Specification

We do not recommend the wave soldering method.

1. Reflow method (Infrared reflow, air reflow)

Frequency:	Three times or less
Temperature:	The following device surface temperature profile is recommended.

Package’s surface temperature

175±10 °C

260 °C max.

255 °C or higher, 10s max.

220 °C or higher, 50s max. 200 °C or higher, 70s max.

1 to 4 °C/s

110±20s

Time

Figure 1: Infrared reflow, air reflow temperature profile

2. Soldering iron (Manual soldering)


Soldering bit’s temperature:		370 °C or lower
Soldering time:	Five seconds or less/terminal

Document No. DER-S0008A

20

Version 1.0 ©2008 DMC Co., Ltd.

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Contents Page Table of Contents Products outline FeaturesScope of Application OutlineUSB General specificationPin layout and representation Marking specificationBeep Pin functionsPaneladyd Eeprom setting Initial settingCommunication mode setting Touch screen mode settingPanel ID setting USB mode Configuration in USB modeAbsolute maximum rating Data sheetMaximum Recommended operational conditionsOutput peak current *2 IOH peak Pin number Timing requirement WH, t WL DC standards Normal Vcc= Icc1 Mode Basic packaging Packaging SpecificationSmall group packaging Product name label specification Tray specificationStorage Specification Storage ConditionsBaking Implementation Temperature Specification Reflow method Infrared reflow, air reflowSoldering iron Manual soldering Cleaning Terminal Pin SpecificationVersion history Changes and improvementsWarranty Period WarrantyWarranty Target Warranty ExceptionsOthers Overall handlingPage Page Page Page Page Page Page Page Page Page Page