AG Neovo TSC-30/IC manual Terminal Pin Specification, Cleaning

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TSC-30/IC Product Specification

9. Terminal Pin Specification

Base material	:Cu
Coat	:Sn-1.5%Cu
Thickness of coat	:5um or above

10. Cleaning

In case of cleaning boards with solvents after soldering, following items should be taken attention.

*Administrative guidance and regulation. *Residual ionic (non ionic) contamination. *Solvent resistance of parts.

Document No. DER-S0008A

21

Version 1.0 ©2008 DMC Co., Ltd.

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Contents Page Table of Contents Scope of Application FeaturesProducts outline OutlineGeneral specification USBMarking specification Pin layout and representationPin functions BeepPaneladyd Communication mode setting Initial settingEeprom setting Touch screen mode settingConfiguration in USB mode Panel ID setting USB modeData sheet Absolute maximum ratingRecommended operational conditions MaximumOutput peak current *2 IOH peak Pin number Timing requirement WH, t WL DC standards Normal Vcc= Icc1 Mode Packaging Specification Basic packagingSmall group packaging Tray specification Product name label specificationStorage Conditions Storage SpecificationBaking Reflow method Infrared reflow, air reflow Implementation Temperature SpecificationSoldering iron Manual soldering Terminal Pin Specification CleaningChanges and improvements Version historyWarranty Target WarrantyWarranty Period Warranty ExceptionsOverall handling OthersPage Page Page Page Page Page Page Page Page Page Page