AG Neovo TSC-30/IC manual Pin layout and representation, Marking specification

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TSC-30/IC Product Specification

2. Pin layout and representation

EEP-CLK/JP10

49

EEP-CS/JP9

50

RxD

51

TxD

52

 

53

EEP-DI/JP11

48

EEP-DO/JP12

47

46

45

44

PANEL_THI

43

PANEL_THOa

42

PANEL_THOb1

41

PANEL_THOb2

40

PANEL_THOb3

39

PEN_UP

38

USB_PW

37

BEEP

36

RxD_I

35

34

33

32

PANEL_UR

31

PANEL_LL

30

PANEL_XR/LR

29

PANEL_XL/UR

28

PANEL_YU/UL

 

54

JP1

55

JP2

56

TSC-30x

27

PANEL_YD/LL

26

D-

25

D+

JP3

57

JP4

58

JP5

59

JP6

60

JP7

61

JP8

62

PANEL_AD_YD

63

PANEL_AD_YU

64

XXX ######

INDEX

24

TrON

 

USBVref

23

 

Vcc

22

 

Vcc

21

 

Vss

20

 

 

19

 

 

LED2

18

 

LED1

17

1

PANEL_AD_XL

2

PANEL_AD_XR

3

SW0

4

SW1

5

6

7

CNVss

8

RESET

9

Vcc

10

Vref

11

Vss

12

Xin

13

Xout

14

Vcc

15

Vss

16

LED0

Marking specification

TSC-30x

Product number x: version number

xxx

ROM number

######

Lot number

Document No. DER-S0008A

4

Version 1.0 ©2008 DMC Co., Ltd.

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Contents Page Table of Contents Products outline FeaturesScope of Application OutlineUSB General specificationPin layout and representation Marking specificationBeep Pin functionsPaneladyd Eeprom setting Initial settingCommunication mode setting Touch screen mode settingPanel ID setting USB mode Configuration in USB modeAbsolute maximum rating Data sheetMaximum Recommended operational conditionsOutput peak current *2 IOH peak Pin number Timing requirement WH, t WL DC standards Normal Vcc= Icc1 Mode Basic packaging Packaging SpecificationSmall group packaging Product name label specification Tray specificationBaking Storage SpecificationStorage Conditions Soldering iron Manual soldering Implementation Temperature SpecificationReflow method Infrared reflow, air reflow Cleaning Terminal Pin SpecificationVersion history Changes and improvementsWarranty Period WarrantyWarranty Target Warranty ExceptionsOthers Overall handlingPage Page Page Page Page Page Page Page Page Page Page