AG Neovo TSC-30/IC manual Overall handling, Others

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TSC-30/IC Product Specification

13. Notes on use

13-1. Overall handling

§When using the product, do not place it close to, or make it contact with, the conductive materials such as metal.

§Do not touch the metal part in the product directly with your hands. Or, it may be destructed by the static electricity. If you contact, or may contact, it directly with your hand, prepare in advance the measure against static electricity.

§To store the product, use an appropriate packing box and keep the storage temperature range with no overload on it.

§In using the product or storing it, avoid the following conditions:

-Conditions where water is, or may be, attached to the product.

-Conditions where condensation takes place, or may take place.

-In the ambience of organic solvent or acidity or contact, or where the product contacts them.

§Do not alter or disassemble the product.

13-2. Others

§This specification may be changed for improvement without prior notices.

§No liabilities are taken by us for any damage caused by use of this product.

§This product intends to be used for the standard applications (e.g. office equipment and OA devices, industrial use, communication devices, household equipment). Avoid its use where failure or malfunction directly may affect the human body or special applications where extremely high reliability is required (e.g. airline and space industries, nuclear controls, medical use for life-sustaining).

§Semi-conductor devices may fail in a certain possibility. Keep the safety design in your mind so that possible failure in this product shall not cause physical accidents such as injury and death, fire and other social damages.

TSC-30/IC Product Specification

Version 1.0: Issued at March 13, 2008

©2008 DMC Co., Ltd.

This document is allowed to redistribute but no alteration, part or all, is prohibited.

http://www.dmccoltd.com/english/

9F Kanda Sent-Building 1-2-4, Yushima, Bunkyo-ku, Tokyo, 113-0034 Japan Phone: +81-3-5209-7131 (Japanese), 7135 (English) Fax: +82-3-5209-7130

Document No. DER-S0008A

24

Version 1.0 ©2008 DMC Co., Ltd.

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Contents Page Table of Contents Products outline FeaturesScope of Application OutlineUSB General specificationPin layout and representation Marking specificationBeep Pin functionsPaneladyd Eeprom setting Initial settingCommunication mode setting Touch screen mode settingPanel ID setting USB mode Configuration in USB modeAbsolute maximum rating Data sheetMaximum Recommended operational conditionsOutput peak current *2 IOH peak Pin number Timing requirement WH, t WL DC standards Normal Vcc= Icc1 Mode Basic packaging Packaging SpecificationSmall group packaging Product name label specification Tray specificationStorage Conditions Storage SpecificationBaking Reflow method Infrared reflow, air reflow Implementation Temperature SpecificationSoldering iron Manual soldering Cleaning Terminal Pin SpecificationVersion history Changes and improvementsWarranty Period WarrantyWarranty Target Warranty ExceptionsOthers Overall handlingPage Page Page Page Page Page Page Page Page Page Page