Samsung ML-1700 specifications Acronyms and Abbreviations, Lsu

REFERENCE INFORMATION

2.2 Acronyms and Abbreviations

The table in the below explains abbreviations used in this service manual.

The contents of this service manual are declared with abbreviations in many parts. Please refer to the table.

AC	Alternating Current	IEEE	Institute of Electrical and Electronics
ASIC	Application Specific Integrated Circuit		Engineers. Inc
ASSY	assembly	IPA	Isopropy Alcohol
BIOS	Basic Input Output System	IPM	Images Per Minute
CMOS	Complementary Metal Oxide	LAN	local area network
Semiconductor		lb	pound(s)
CN	connector	LBP	Laser Beam Printer
CON	connector	LCD	Liquid Crystal Display
CPU	Central Processing Unit	LED	Light Emitting Diode
dB	decibel	LSU	Laser Scanning Unit
dbA	decibelampere	MB	megabyte
dBM	decibel milliwatt	MHz	megahertz
DC	direct current	NVRAM	nonvolatile random access memory
DCU	Diagnostic Control Unit	OPC	Organic Photo Conductor
DPI	Dot Per Inch	PBA	Printed Board Assembly
DRAM	Dynamic Random Access Memory	PCL	Printer Command Language , Printer
DVM	Digital Voltmeter		Control Language
ECP	Enhanced Capability Port	PDL	Page Discription Language
EEPROM	Electronically Erasable Programmable	PPM	Page Per Minute
	Read Only Memory	PTL	Pre-Transfer Lamp
EMI	Electro Magnetic Interference	Q-PID	Quick Printer Initiating Device
EP	electrophotographic	Q ty	quantity
EPP	Enhanced Parallel Port	RAM	Random Access Memory
F/W	firmware	ROM	Read Only Memory
GDI	graphics device interface	SCF	Second Cassette Feeder
GND	ground	SMPS	Switching Mode Power Supply
HBP	Host Based Printing	SPGP	Samsung Printer Graphic Processor
HDD	Hard Disk Drive	SPL	Samsung Printer Language
HV	high voltage	Spool	Simultaneous Peripheral Operation Online
HVPS	High Voltage Power Supply	SW	switch
I/F	interface	sync	synchronous or synchronization
I/O	Input and Output	USB	Universal Serial Bus
IC	integrated circuit
IDE	Intelligent Drive electronics or Imbedded
	Drive Electronics

Service Manual

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