AG Neovo TSC-40/IC manual Terminal Pin Specification, Cleaning

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TSC-40/IC Product Specification

9. Terminal Pin Specification

Base material	:Cu
Coat	:Sn-1.5%Cu
Thickness of coat	:5um or above

10. Cleaning

In case of cleaning boards with solvents after soldering, following items should be taken attention.

*Administrative guidance and regulation. *Residual ionic (non ionic) contamination. *Solvent resistance of parts.

Document No. DER-S0026A

17

Version 1.2 ©2008 DMC Co., Ltd.

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Contents Page Table of Contents Dimensional Drawing Circuit DiagramFeatures Scope of ApplicationOutline General specification Marking specification Pin layout and representationPin functions EEP-DOTSC-40/IC Product Specification Touch screen mode setting Initial settingEeprom setting Power supply voltage settingData sheet Absolute maximum ratingRecommended operational conditions MaximumTiming requirement RSTDC standards Packaging Specification Basic packagingSmall group packaging Tray specification Product name label specificationStorage Specification Storage ConditionsBaking Wave soldering method Flow soldering, solder dip method Implementation Temperature SpecificationReflow method Infrared reflow, air reflow Soldering iron Manual solderingTerminal Pin Specification CleaningChanges and improvements Version historyWarranty Target WarrantyWarranty Period Warranty ExceptionsOverall handling OthersPage