AG Neovo TSC-40/IC manual Storage Specification, Storage Conditions, Baking

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TSC-40/IC Product Specification

7. Storage Specification

7-1. Storage Conditions

For storing the product until its implementation, it is recommended that the following storage conditions are applied:

1. Before unpacking the damp-proof package (Aluminum laminate bag)

Temperature and humidity:

5 to 40 °C, 20 - 80%RH

Duration:

Two years or less

2. After unpacking the damp-proof package (Aluminum laminate bag)

For the storing duration after the damp-proof package is unpacked and before the implementation, it is recommended that the following storage conditions is to be applied:

(1) Reflow method:

One week or less under the ambient condition: 30 °C, 70%RH or less

(2) Wave soldering method: One week or less under the ambient condition: 30 °C, 70%RH or less

3.Temporary storage after damp-proof package is unpacked

To store again temporarily the once unpacked and unused damp-proof package, it is recommended to pack it again into another damp-proof bag with desiccant within a shorter time after opened (Around 10 minutes) as far as possible, and fold the bag’s opening, followed by sealing with adhesive material such as adhesive tape, then store it under the following conditions:

Temperature, humidity:

5 to 40 °C, 20 - 80%RH

Duration:

One month or less

7-2. Baking

If any condition among those 1 to 3 listed below is applicable, it is recommended to apply the baking as described below to dry the moisture the package absorbs.

You may place the tray used for damp-proof packaging directly into the thermostatic chamber since the tray is heat-proof type. When placing into the chamber or after removing from it, to avoid deformation, cool the tray by placing it on the flat plate such as surface table.

1.Any condition among 1 to 3 in [7-1. Storage condition] is unsatisfied

2.Indicator’s 30% Humidity Check section changes the color to lavender or pink

3.Blue color indicator of desiccant (Silica gel) changes to pink or white

Baking method

 

Temperature:

125 °C

Duration:

20 to 24 hours

Frequency:

Four times or less (Upper limit: 96 accumulative hours)

Document No. DER-S0026A

15

Version 1.2 ©2008 DMC Co., Ltd.

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Contents Page Table of Contents Dimensional Drawing Circuit DiagramScope of Application FeaturesOutline General specification Marking specification Pin layout and representationPin functions EEP-DOTSC-40/IC Product Specification Initial setting Eeprom settingTouch screen mode setting Power supply voltage settingData sheet Absolute maximum ratingRecommended operational conditions MaximumTiming requirement RSTDC standards Packaging Specification Basic packagingSmall group packaging Tray specification Product name label specificationStorage Conditions Storage SpecificationBaking Implementation Temperature Specification Reflow method Infrared reflow, air reflowWave soldering method Flow soldering, solder dip method Soldering iron Manual solderingTerminal Pin Specification CleaningChanges and improvements Version historyWarranty Warranty PeriodWarranty Target Warranty ExceptionsOverall handling OthersPage