TSC-40/IC Product Specification
7. Storage Specification
7-1. Storage Conditions
For storing the product until its implementation, it is recommended that the following storage conditions are applied:
1. Before unpacking the
Temperature and humidity: | 5 to 40 °C, 20 - 80%RH |
Duration: | Two years or less |
2. After unpacking the
For the storing duration after the
(1) Reflow method: | One week or less under the ambient condition: 30 °C, 70%RH or less |
(2) Wave soldering method: One week or less under the ambient condition: 30 °C, 70%RH or less
3.Temporary storage after
To store again temporarily the once unpacked and unused
Temperature, humidity: | 5 to 40 °C, 20 - 80%RH |
Duration: | One month or less |
7-2. Baking
If any condition among those 1 to 3 listed below is applicable, it is recommended to apply the baking as described below to dry the moisture the package absorbs.
You may place the tray used for
1.Any condition among 1 to 3 in
2.Indicator’s 30% Humidity Check section changes the color to lavender or pink
3.Blue color indicator of desiccant (Silica gel) changes to pink or white
Baking method |
|
Temperature: | 125 °C |
Duration: | 20 to 24 hours |
Frequency: | Four times or less (Upper limit: 96 accumulative hours) |
Document No. | 15 | Version 1.2 ©2008 DMC Co., Ltd. |