TSC-40/IC Product Specification
8. Implementation Temperature Specification
1. Reflow method (Infrared reflow, air reflow)
Frequency: | Three times or less |
Temperature: | The following device surface temperature profile is recommended. |
Package’s surface temperature
175±15 °C
260 °C max.
255 °C or above,
220 °C or above, 60s max.
1 to 4 °C/s
110±30s
Time
| Figure 1: Infrared reflow, air reflow temperature profile |
2. Wave soldering method (Flow soldering, solder dip method) | |
Frequency: | One time or less |
Temperature: | Following temperature profile is recommended (Set the optimal preheat temperature |
| according to the flux type) |
Temperature
10s max. (Primary + Secondary flow
passage duration) 
260 °C max.
80 to 150 °C (Package surface temperature)
Time
Figure 2: Wave soldering temperature profile
3. Soldering iron (Manual soldering)
Soldering bit’s temperature: | 370 °C or lower | |
Soldering time: | Five seconds or less/terminal | |
Document No. | 16 | Version 1.2 ©2008 DMC Co., Ltd. |