AG Neovo TSC-40/IC manual Packaging Specification, Basic packaging

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TSC-40/IC Product Specification

6. Packaging Specification

6-1. Outline

With a basic packaging unit of 2000, TSC-40/IC is packaged for the number of 2000 and its multiple using damp-proof aluminum laminate bags (Basic packaging). If the delivery quantity is less than 2000 or not multiple of 2000, or the product can not be packaged with a unit of 2000, then no damp-proof packaging specification is applicable (Small group packaging).

If packaged with small group packaging, the products may be dampened. Before packaging, the product shall take the baking process as specified in [Baking] defined in “TSC-40/IC Storage/Implementation Specification”.

6-2. Notes on storage/handling

(1)Handle the packages with care and avoid throwing and dropping them. Or, a large impact may be imposed, causing packaging material’s damage, broken package or bending lead.

(2)Cardboard box may be deteriorated in its strength and deformed due to storage site’s humidity, stacking condition and storage duration. It is desirable to keep the storage under normal temperature/humidity (5 to 35 °C, 45 to 75%RH). For warehousing, follow the FIFO principle.

(3)After unpacking, be careful in handling the product to avoid electrostatic breakdown.

6-3. Basic packaging

6-3-1. Packaging type

Damp-proof packaging (Aluminum laminate bag)

6-3-2. Packaging quantity specification

Quantity per tray

Number of trays

Quantity per packages

250

8 + 1(cover)

2000

Desiccant

Tray

 

Product name label

Humidity indicator

Aluminum laminate bag

 

 

Packaging label

Packaging label

Product name label

Packaging box

Document No. DER-S0026A

12

Version 1.2 ©2008 DMC Co., Ltd.

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Contents Page Dimensional Drawing Circuit Diagram Table of ContentsScope of Application FeaturesOutline General specification Pin layout and representation Marking specificationEEP-DO Pin functionsTSC-40/IC Product Specification Eeprom setting Initial settingTouch screen mode setting Power supply voltage settingAbsolute maximum rating Data sheetMaximum Recommended operational conditionsRST Timing requirementDC standards Basic packaging Packaging SpecificationSmall group packaging Product name label specification Tray specificationStorage Conditions Storage SpecificationBaking Reflow method Infrared reflow, air reflow Implementation Temperature SpecificationWave soldering method Flow soldering, solder dip method Soldering iron Manual solderingCleaning Terminal Pin SpecificationVersion history Changes and improvementsWarranty Period WarrantyWarranty Target Warranty ExceptionsOthers Overall handlingPage