AG Neovo TSC-40/IC manual Small group packaging

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TSC-40/IC Product Specification

6-3-3. Diagram for packaging box sizes

L: 330 W: 152 D: 75 (mm)

6-4. Small group packaging

6-4-1. Packaging type

General packaging (No damp-proof processing)

6-4-2. Packaging quantity specification

Quantity per tray	Number of trays	Quantity per packages
250	1 to 8 +1(cover)	1 - 1999
	Number of trays: 1 to 8
Desiccant	(Additionally, one dummy tray pl		Air cap
	aced at the top for reinforcing)

Product name label

Antistatic bag

* No sizes specified for packaging box (Cardboard box) used for transportation.

Document No. DER-S0026A

13

Version 1.2 ©2008 DMC Co., Ltd.

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Contents Page Table of Contents Dimensional Drawing Circuit DiagramOutline FeaturesScope of Application General specification Marking specification Pin layout and representationPin functions EEP-DOTSC-40/IC Product Specification Touch screen mode setting Initial settingEeprom setting Power supply voltage settingData sheet Absolute maximum ratingRecommended operational conditions MaximumTiming requirement RSTDC standards Packaging Specification Basic packagingSmall group packaging Tray specification Product name label specificationBaking Storage SpecificationStorage Conditions Wave soldering method Flow soldering, solder dip method Implementation Temperature SpecificationReflow method Infrared reflow, air reflow Soldering iron Manual solderingTerminal Pin Specification CleaningChanges and improvements Version historyWarranty Target WarrantyWarranty Period Warranty ExceptionsOverall handling OthersPage