MODELS:
Using Lead Free Solder
The symbol shown below indicates Lead (Pb) Free |
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solder was used during the construction of PWBs. |
| • Higher temperatures can cause flux spattering. | |||||
Only Lead Free solder should be used when servic- | • Soldering iron tip life is shortened. |
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ing these PWBs. |
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| • Dull finish solder joints (not shiny) can appear to be | ||||
Solder must be compatible with that used by the |
| a “cold” solder joint. |
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manufacturer. Leaded solder can not be used on |
| In general a tip temperature of 700° F will usually provide | |||||
PWBs manufactured with | good results. |
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ishi standard for service requires the use of |
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Copper | Displays used to indicate | ||||||
through the Parts Department. |
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Order part number: PB FREE SOLDER |
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| PCBs will be marked, indicating the level of | ||||
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| struction. Table 1 defines the levels by phase and shows | ||||
Lead Free solder has a higher melting point, and does | the different symbols that will be displayed on the PCB. | ||||||
not “wet” as well as leaded solder. This means it does | Additionally, a PCB constructed using | ||||||
not adhere as readily to the solder iron tip, and the |
| be simply marked LFS. |
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surface to be soldered. To counteract this, the flux |
| When possible, the indication will be placed close to the | |||||
used is more corrosive. |
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| part number that is screened onto the PCB (not the part | ||||
The following cautions must be taken when using Pb | label). Figure 1 is an example of a PCB showing the | ||||||
Free solder. |
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| display and its location. |
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• Higher temperatures can cause the PWB to |
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warp, detaching surface mount components. |
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• Higher temperatures may cause |
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| Short Display (When the | ||
thermal damage to components. |
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Phase |
| Definition |
| Display | area is too small) | ||
• Higher temperatures can cause |
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PCB's constructed using |
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plastics, such as connectors, |
| Pb | Solder | Pb | S | ||
relays, LEDs electrolytic |
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capacitors, etc. to melt or warp. | Solder, PCB surface |
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• Higher temperatures can cause |
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surface oxidation resulting in |
| finishing and component | Pb | Joints | Pb | J | |
| lead plating is | ||||||
poor solder |
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| Components may have |
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| internal Pb. |
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• The flux is more corrosive. | Solder, PCB surface |
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• The time required for a good |
| finishing and components | Pb | PCA | Pb | P | |
solder connection may take |
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longer. |
| free) |
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Table 1:
Display
Pb Solder
Figure 1: Pb-Free display on PWB
Page 37