
MODELS: 
Using Lead Free Solder
| The symbol shown below indicates Lead (Pb) Free | 
 | • Poor  | 
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| solder was used during the construction of PWBs. | 
 | • Higher temperatures can cause flux spattering. | |||||
| Only Lead Free solder should be used when servic- | • Soldering iron tip life is shortened. | 
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| ing these PWBs. | 
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 | • Dull finish solder joints (not shiny) can appear to be | ||||
| Solder must be compatible with that used by the | 
 | a “cold” solder joint. | 
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| manufacturer. Leaded solder can not be used on | 
 | In general a tip temperature of 700° F will usually provide | |||||
| PWBs manufactured with  | good results. | 
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| ishi standard for service requires the use of  | 
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| Copper  | Displays used to indicate  | ||||||
| through the Parts Department. | 
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| Order part number: PB FREE SOLDER | 
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 | PCBs will be marked, indicating the level of  | ||||
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 | struction. Table 1 defines the levels by phase and shows | ||||
| Lead Free solder has a higher melting point, and does | the different symbols that will be displayed on the PCB. | ||||||
| not “wet” as well as leaded solder. This means it does | Additionally, a PCB constructed using  | ||||||
| not adhere as readily to the solder iron tip, and the | 
 | be simply marked LFS. | 
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| surface to be soldered. To counteract this, the flux | 
 | When possible, the indication will be placed close to the | |||||
| used is more corrosive. | 
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| 
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 | part number that is screened onto the PCB (not the part | ||||
| The following cautions must be taken when using Pb | label). Figure 1 is an example of a PCB showing the | ||||||
| Free solder. | 
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 | display and its location. | 
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| • Higher temperatures can cause the PWB to | 
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| warp, detaching surface mount components. | 
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| • Higher temperatures may cause | 
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 | Short Display (When the | ||
| thermal damage to components. | 
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| Phase | 
 | Definition | 
 | Display | area is too small) | ||
| • Higher temperatures can cause | 
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| PCB's constructed using | 
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| plastics, such as connectors, | 
 | Pb | Solder | Pb | S | ||
| relays, LEDs electrolytic | 
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| capacitors, etc. to melt or warp. | Solder, PCB surface | 
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| • Higher temperatures can cause | 
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| surface oxidation resulting in | 
 | finishing and component | Pb | Joints | Pb | J | |
| 
 | lead plating is  | ||||||
| poor solder  | 
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| 
 | Components may have | 
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 | internal Pb. | 
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| • The flux is more corrosive. | Solder, PCB surface | 
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| • The time required for a good | 
 | finishing and components | Pb | PCA | Pb | P | |
| solder connection may take | 
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| longer. | 
 | free) | 
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Table 1: 
Display
Pb Solder
Figure 1: Pb-Free  display on PWB
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