Sony MZ-R90/R91 Flexible Circuit Board Repairing, Notes on chip component replacement

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Flexible Circuit Board Repairing

Dimensions

Approx. 81 74 26.2 mm (w/h/d)

(3 1/4 3 1 1/16 in.) without projections. Mass

Approx. 115 g (4 oz) the recorder only Approx. 155 g (5.4 oz) incl. a recordable MD, and NC-WMAA nickel cadmium rechargeable battery

Supplied accessories

AC power adaptor (1)

Headphones with a remote control (1) Optical cable (1)

NC-WMAA nickel cadmium rechargeable battery (1)

Rechargeable battery carrying case (1) Carrying pouch (1)

Design and specifications are subject to change without notice.

Flexible Circuit Board Repairing

Keep the temperature of the soldering iron around 270°C during repairing.

Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

Never reuse a disconnected chip component.

Notice that the minus side of a tantalum capacitor may be damaged by heat.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

This MiniDisc player is classi- fied as a CLASS 1 LASER product.

The CLASS 1 LASER PRODUCT label is located on the bottom exterior.

IN NO EVENT SHALL SELLER BE

LIABLE FOR ANY DIRECT,

INCIDENTAL OR CONSEQUENTIAL

DAMAGES OF ANY NATURE, OR

LOSSES OR EXPENSES RESULTING

FROM ANY DEFECTIVE PRODUCT

OR THE USE OF ANY PRODUCT.

“MD WALKMAN” is a trademark of Sony Corporation.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN

THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0SUR LES

DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

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Contents AEP Model US ModelCanadian Model UK ModelFlexible Circuit Board Repairing Notes on chip component replacementTABLE OF CONTENTS NOTES ON HANDLING THE OPTICAL PICK-UPBLOCK LCX-2R SECTION SERVICING NOTENOTES ON LASER DIODE EMISSION CHECK OPTICAL PICK-UPFLEXIBLE BOARDSECTION 2 GENERAL Page Page SECTION DISASSEMBLY 3-3.LCD MODULE 3-4.MAIN BOARDover write head section 3-6.SERVICE ASSY, OP3-5.MD MECHANISM DECK MT-MZR70-165 3-7.HOLDER ASSY 3-8.MOTOR FLEXIBLE BOARD3-9.MOTOR, DC M602 3-10.“MOTOR, DC M601”, “MOTOR, DC M603”4-2-1.Setting Method of Test Mode SECTION 4 TEST MODE4-2-2.Operation in Setting the Test Mode 888xxxxxxxxxFREC1SHUF000M a n u a l 011 0 6 3 B 011 C 6 8 S011 0 F FJ 011 0 5 9 A000S t a t 000A d r s 000B E m p 000# # # # # # 000P * * RE I B 000P * * R 000B O v r 000B f u l 000R t r y000N - 1 000N - 1 000N - 2 000N - 2 000N 0001 s t0001 s t 0001 s t 0001 s t 000R # # # #Description of Error Indication Codes • Description of Indication History4-7.KEY CHECK MODE 021R e s O K ? SECTION ELECTRICAL ADJUSTMENTS021R e s N 021R e s763V r h V c l 762V c l P W M765V c h P W M 766V r h V c hC D R U N 014S e t T m p000 A s s y 341 C D O KConnection 043R e s u m e043R e s C l r Check MethodConnecting Location SECTION DIAGRAMSMZ-R70 MZ-R70 Waveforms 6-3.BLOCK DIAGRAM - POWER SUPPLY SECTIONMZ-R70 Page Page Refer to page 41 for IC Block Diagrams MZ-R70MZ-R70 MZ-R70 IC302 IC501SN761056 NJM2173IC603 IC601MPC17A56FTA MPC18A21MTBAK4517-VQ-L IC901 MPC18A31FTAIC301 6-9.IC PIN DESCRIPTIONS MAIN BOARD IC502 CXD2660GA Page Page Page Page Page SECTION EXPLODED VIEWS Page SECTION ELECTRICAL PARTS LIST MAINMAIN MAIN MAIN MAIN Personal Audio Division Company Sony CorporationMZ-R70 Published by General Engineering DeptVer US Model Canadian Model AEP Model UK ModelE Model Australian Model Chinese Model Subject Taiwan model Addition