Sony MZ-R90/R91, MT-MZR70-165 Section Servicing Note, Notes On Laser Diode Emission Check

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SECTION 1

SECTION 1

SERVICING NOTE

•When repairing this device with the power on, if you remove the MAIN board or open the upper panel assy, this device stops working.

In this case, you can work without the device stopping by fas- tening the hook of the open/close detect switch (S801) with tape.

Tape

MAIN board

S801

•This set is designed to perform automatic adjustment for each adjustment and write its value to EEPROM. Therefore, when EEPROM (IC802) has been replaced in service, be sure to per- form automatic adjustment and write resultant values to the new

EEPROM.

(Refer to page 20.)

•Replacement of CXD2660R (IC502) and CXR701081 (IC801) used in this set requires a special tool. Therefore, they cannot be replaced.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right avove when checking it for adustment. It is feared that you will lose your sight.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (LCX-2R)

The laser diode in the optical pick-up block may suffer electrostatic break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform measures against electrostatic break-down sufficiently before the operation. The flexible board is easily damaged and should be handled with care.

laser-tap

OPTICAL PICK-UP FLEXIBLE BOARD

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Contents US Model Canadian ModelAEP Model UK ModelFlexible Circuit Board Repairing Notes on chip component replacementTABLE OF CONTENTS SECTION SERVICING NOTE NOTES ON LASER DIODE EMISSION CHECKNOTES ON HANDLING THE OPTICAL PICK-UPBLOCK LCX-2R OPTICAL PICK-UPFLEXIBLE BOARDSECTION 2 GENERAL Page Page SECTION DISASSEMBLY 3-3.LCD MODULE 3-4.MAIN BOARD3-5.MD MECHANISM DECK MT-MZR70-165 3-6.SERVICE ASSY, OPover write head section 3-7.HOLDER ASSY 3-8.MOTOR FLEXIBLE BOARD3-9.MOTOR, DC M602 3-10.“MOTOR, DC M601”, “MOTOR, DC M603”SECTION 4 TEST MODE 4-2-2.Operation in Setting the Test Mode4-2-1.Setting Method of Test Mode 888xxxxxxxxxFREC1SHUF000M a n u a l 011 C 6 8 S 011 0 F FJ011 0 6 3 B 011 0 5 9 A000P * * R E I B000S t a t 000A d r s 000B E m p 000# # # # # # 000P * * R 000B O v r 000B f u l 000R t r y0001 s t 0001 s t 0001 s t 0001 s t000N - 1 000N - 1 000N - 2 000N - 2 000N 000R # # # #Description of Error Indication Codes • Description of Indication History4-7.KEY CHECK MODE SECTION ELECTRICAL ADJUSTMENTS 021R e s N021R e s O K ? 021R e s762V c l P W M 765V c h P W M763V r h V c l 766V r h V c h014S e t T m p 000 A s s yC D R U N 341 C D O K043R e s u m e 043R e s C l rConnection Check MethodConnecting Location MZ-R70 DIAGRAMSSECTION MZ-R70 MZ-R70 6-3.BLOCK DIAGRAM - POWER SUPPLY SECTIONWaveforms Page Page Refer to page 41 for IC Block Diagrams MZ-R70MZ-R70 MZ-R70 IC501 SN761056IC302 NJM2173IC601 MPC17A56FTAIC603 MPC18A21MTBIC301 IC901 MPC18A31FTAAK4517-VQ-L 6-9.IC PIN DESCRIPTIONS MAIN BOARD IC502 CXD2660GA Page Page Page Page Page SECTION EXPLODED VIEWS Page SECTION ELECTRICAL PARTS LIST MAINMAIN MAIN MAIN MAIN Sony Corporation MZ-R70Personal Audio Division Company Published by General Engineering DeptUS Model Canadian Model AEP Model UK Model E Model Australian Model Chinese ModelVer Subject Taiwan model Addition
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