Sony MDS-SD1 Waveforms, Display Section, For schematic diagrams, For printed wiring boards

Page 35

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.

(In addition to this, the necessary note is printed in each block.)

For schematic diagrams.

Note:

All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

All resistors are in Ω and 1/4 W or less unless otherwise specified.

¢ : internal component.

C : panel designation.

Note: The components identified by mark !or dotted line with mark !are critical for safety.

Replace only with part number specified.

U : B+ Line.

V : B– Line.

H : adjustment for repair.

no mark : STOP

(

) : Play the test disc (TDYS-1)

<> : REC

: Can not be measured.

Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

Circled numbers refer to waveforms.

Signal path.

E : PB

q : REC

a : PB (DIGITAL OUT)

r : REC (DIGITAL IN)

Abbreviation

HK

: Hong Kong model.

SP

: Singapore model.

For printed wiring boards.

Note:

X : parts extracted from the component side.

Y : parts extracted from the conductor side.

p : parts mounted on the conductor side.

® : Through hole.

b: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:

Pattern face side: Parts on the pattern face side seen from the

(Side B) pattern face are indicated.

Parts face side: Parts on the parts face side seen from the

(Side A)

parts face are indicated.

Indication of transistor

C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Q

 

 

These are omitted

 

 

 

 

 

 

 

 

 

 

 

B E

 

 

 

BC E

These are omitted

WAVEFORMS

– BD (1/2) SECTION –

1

0.46Vp-p

IC101 1, 2 (I, J) (PLAY mode)

2

0.1Vp-p

IC101 4 (A) (PLAY mode)

3

0.06Vp-p

IC101 8, 9 (E, F) (PLAY mode)

– BD (1/2) SECTION –

4

3.1Vp-p

22.581MHz

IC121 (OSCI)

5

3.2Vp-p

44.1kHz

IC121 (LRCK)

6

3.8Vp-p

2.822MHz

IC121 @• (XBCK)

7

3.8Vp-p

11.29MHz

IC121 (FS256)

8

3.2Vp-p

176.4kHz

IC121 (FS4)

MDS-SD1

– MAIN SECTION –

1

3.2Vp-p

10MHz

IC701 (XOUT)

2

3.8Vp-p

44.1kHz

IC201 (LRCK1)

3

3.4Vp-p

2.822MHz

IC201 (BCK)

4

3.0Vp-p

22.581MHz

IC201 !™ (SYSCLK)

– DISPLAY SECTION –

1

3.9Vp-p

2.4MHz

IC901 %• (OSCO)

– 37 –

– 38 –

Image 35
Contents MBU-5A SpecificationsMDS-JE520 MDM-5ASELF-DIAGNOSIS Function Items of Error History Mode Items and Contents Parts No Flexible Circuit Board RepairingSpecification Label Exploded Views Table of ContentsDisassembly DiagramsJIG for Checking BD Board Waveform Section Servicing NoteRecord Precedure Criteria for Determination Measure if unsatisfactory Checks Prior to Parts Replacement and AdjustmentsMain Board Component Side Forced ResetFluorescent Indicator Tube and Mechanism Deck Cleaning of Objective Lens of Optical PickupFluorescent Indicator TUBE, LED Complete Lighting Check Attaching the Glass AssemblyServicing Position Binary Retry Cause Display ModeHigher Bits Lower Bits Hexa Cause of Retry Occurring conditionsHexadecimal Binary Bit When BinaryHigher Bits Lower Bits Hexa Details Front Panel Location of Parts and Controls Section GeneralFront Panel Section DisassemblyGlass Assy Base Unit and BD Board Slider CAMSW Board and Loading Motor M103 Exiting the Test Mode Section Test ModePrecautions for USE of Test Mode Setting the Test ModeGroup Selecting the Test ModeFunctions of Other Buttons Operating the Continuous Playback ModeNon-Volatile Memory Mode EEP Mode Test Mode Displays Parts Replacement and Adjustment Section Electrical AdjustmentsCreating Continuously Recorded Disc Precautions for Checking Laser Diode EmissinonPrecautions for USE of Optical PICK- UP KMS-260A Precautions for AdjustmentsSpecified Value Temperature Compensation Offset CheckLaser Power Check Checks Prior to RepairsSelf-Recording/playback Check Play Checking MO Error Rate CheckCD Error Rate Check Focus Bias CheckRecording and Displaying the IOP Information Initial Setting of Adjustment ValueTemperature Compensation Offset Adjutment Laser Power AdjustmentTraverse Adjustment Focus Bias Adjustment MO Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment CD Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points Circuit Boards Location Section DiagramsREC Digital Block Diagrams BD SectionMDS-SD1 PB Digital outRECDigital Main SectionPBDigital out Display Section For schematic diagramsFor printed wiring boards WaveformsSemiconductor Location Printed Wiring Board BD SectionSchematic Diagram BD 1/2 Section Schematic Diagram BD 2/2 Section Schematic Diagram Main 1/2 Section Schematic Diagram Main 2/2 Section Printed Wiring Board Main Section Schematic Diagram Panel Section Printed Wiring Board Panel Section Schematic Diagram Connector Section System Control To HCD-SD1 Printed Wiring Board Connector SectionMDS-SD1 BD Section IC101 IC Block DiagramsIC301 LB1641 IC152 BH6511FS-E2Main Section IC201 UDA1341TS/N2 IC851 M5293L Connector Section IC774 P82B715TD.118IC822 M62016FP-E1 Pin No Pin Name Function IC PIN FunctionsIC101 CXA2523AR RF Amplifier BD Board IC701 M30610MC-A01FP System Control ∝CON Main Board CHAK-IN Case and Back Panel Section Section Exploded Views67 A-4724-619-A Panel BOARD, Complete FL901 1-517-804-11 Indicator TUBE, FluorescentFront Panel Section Panel SW Board209 4-988-466-21 Spring ELECTROSTATIC, Leaf Mechanism Deck Section MDM-5AInsulator F Motor ASSY, Sled Base Unit Section MBU-5AHEAD, Over Light Section Electrical Parts List Connector Connector Encoder Main Main Ferite InductorLine Filter FILTER, LinePanel Panel SW Screw +B Accessories & Packing Materials FILTER, Clamp Ferrite CoreMANUAL, Instruction English MANUAL, Instruction CHINESESP,HK Hardware ListSony Corporation