Sony MDS-SD1 service manual Flexible Circuit Board Repairing, Specification Label, Parts No

Page 4

CAUTION

Danger of explosion if battery is incorrectly replaced.

Replace only with the same or equivalent type recommended by the equipment manufacturer.

Discard used batteries according to manufacture’s instructions.

ADVARSEL!

Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering.

Udskiftning må kun ske med batteri af samme fabrikat og type.

Levér det brugte batteri tilbage til leverandøren.

ADVARSEL

Eksplosjonsfare ved feilakting skifte av batteri.

Benytt samme batteritype eller en tilsvarende type anbefalt av

apparatfabrikanten.

Brukte batterier katterier kasseres i henhold til fabrikantens

VARNIG

Explosionsfara vid felaktigt batteribyte.

Använd samma batterityp eller en likvärdig typ som rekommenderas av apparattillverkaren.

Kassera använt batteri enligt gällande föreakrifter.

VAROITUS

Parist voi räjähtää, jos se on virheellisesti asennettu.

Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

SAFETY-RELATED COMPONENT WARNING !!

COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN

THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of soldering iron around 270˚C during repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

MODEL IDENTIFICATION

– Specification Label –

 

 

Parts No.

 

 

 

 

 

MODEL

PARTS No.

 

AEP, UK model

4-212-572-1π

 

SP, HK model

4-212-572-2π

 

• Abbreviation

 

 

HK

: Hong Kong model

SP

: Singapore model

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Contents Specifications MDS-JE520MDM-5A MBU-5ASELF-DIAGNOSIS Function Items of Error History Mode Items and Contents Specification Label Flexible Circuit Board RepairingParts No Table of Contents DisassemblyDiagrams Exploded ViewsSection Servicing Note JIG for Checking BD Board WaveformRecord Precedure Checks Prior to Parts Replacement and Adjustments Criteria for Determination Measure if unsatisfactoryForced Reset Main Board Component SideCleaning of Objective Lens of Optical Pickup Fluorescent Indicator Tube and Mechanism DeckAttaching the Glass Assembly Fluorescent Indicator TUBE, LED Complete Lighting CheckServicing Position Retry Cause Display Mode Higher Bits Lower Bits HexaCause of Retry Occurring conditions BinaryHigher Bits Lower Bits Hexa Details Bit When BinaryHexadecimal Binary Section General Front Panel Location of Parts and ControlsGlass Assy Section DisassemblyFront Panel Slider CAM Base Unit and BD BoardSW Board and Loading Motor M103 Section Test Mode Precautions for USE of Test ModeSetting the Test Mode Exiting the Test ModeSelecting the Test Mode GroupNon-Volatile Memory Mode EEP Mode Operating the Continuous Playback ModeFunctions of Other Buttons Test Mode Displays Section Electrical Adjustments Parts Replacement and AdjustmentPrecautions for Checking Laser Diode Emissinon Precautions for USE of Optical PICK- UP KMS-260APrecautions for Adjustments Creating Continuously Recorded DiscTemperature Compensation Offset Check Laser Power CheckChecks Prior to Repairs Specified ValuePlay Checking MO Error Rate Check CD Error Rate CheckFocus Bias Check Self-Recording/playback CheckInitial Setting of Adjustment Value Temperature Compensation Offset AdjutmentLaser Power Adjustment Recording and Displaying the IOP InformationTraverse Adjustment Focus Bias Adjustment Error Rate Check Auto Gain Control Output Level AdjustmentCD Auto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points Section Diagrams Circuit Boards LocationBlock Diagrams BD Section MDS-SD1PB Digital out REC DigitalPBDigital out Main SectionRECDigital For schematic diagrams For printed wiring boardsWaveforms Display SectionPrinted Wiring Board BD Section Semiconductor LocationSchematic Diagram BD 1/2 Section Schematic Diagram BD 2/2 Section Schematic Diagram Main 1/2 Section Schematic Diagram Main 2/2 Section Printed Wiring Board Main Section Schematic Diagram Panel Section Printed Wiring Board Panel Section Schematic Diagram Connector Section Printed Wiring Board Connector Section System Control To HCD-SD1MDS-SD1 IC Block Diagrams BD Section IC101Main Section IC201 UDA1341TS/N2 IC152 BH6511FS-E2IC301 LB1641 IC822 M62016FP-E1 Connector Section IC774 P82B715TD.118IC851 M5293L IC101 CXA2523AR RF Amplifier BD Board IC PIN FunctionsPin No Pin Name Function IC701 M30610MC-A01FP System Control ∝CON Main Board CHAK-IN Section Exploded Views Case and Back Panel SectionFL901 1-517-804-11 Indicator TUBE, Fluorescent Front Panel SectionPanel SW Board 67 A-4724-619-A Panel BOARD, CompleteInsulator F Mechanism Deck Section MDM-5A209 4-988-466-21 Spring ELECTROSTATIC, Leaf HEAD, Over Light Base Unit Section MBU-5AMotor ASSY, Sled Section Electrical Parts List Connector Connector Encoder Main Main Inductor Line FilterFILTER, Line FeritePanel Panel SW Accessories & Packing Materials FILTER, Clamp Ferrite Core MANUAL, Instruction EnglishMANUAL, Instruction CHINESESP,HK Hardware List Screw +BSony Corporation
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