Sony MDS-SD1 Precautions for Checking Laser Diode Emissinon, Precautions for Adjustments

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5-2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSINON

To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight.

5-3. PRECAUTIONS FOR USE OF OPTICAL PICK- UP (KMS-260A)

As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder first. Before connect- ing the connector, be careful not to remove the solder. Also take adequate measures to prevent damage by static electricity. Handle the flexible board with care as it breaks easily.

pick-up

flexible board

 

laser tap

Optical pick-up flexible board

5-4. PRECAUTIONS FOR ADJUSTMENTS

1)When replacing the following parts, perform the adjustments and checks with ¬ in the order shown in the following table.

 

Optical

 

 

BD Board

 

 

Pick-up

IC171

D101

 

IC101, IC121

IC192

 

 

 

 

 

 

 

1. Initial setting of

¬

¬

G

 

¬

G

adjustment value

 

 

 

 

 

 

 

 

2. Recording of IOP

 

 

 

 

 

 

information

¬

¬

G

 

G

G

(Value written in

 

the pick-up)

 

 

 

 

 

 

 

 

 

 

 

 

 

3. Temperature

 

 

 

 

 

 

compensation

G

¬

¬

 

G

G

offset adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

4. Laser power

¬

¬

G

 

¬

¬

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5. Traverse

¬

¬

G

 

¬

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6. Focus bias

¬

¬

G

 

¬

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

7. Error rate check

¬

¬

G

 

¬

G

 

 

 

 

 

 

 

8. Auto gain output

¬

¬

G

 

¬

G

level adjustment

 

 

 

 

 

 

2)Set the test mode when performing adjustments. After completing the adjustments, exit the test mode.

Perform the adjustments and checks in “group S” of the test mode.

3)Perform the adjustments to be needed in the order shown.

4) Use the following tools and measuring devices.

Check Disc (MD) TDYS-1 (Parts No. 4-963-646-01)

Test Disk (MDW-74/AU-1) (Parts No. 8-892-341-41)

Laser power meter LPM-8001 (Parts No. J-2501-046-A)

or

MD Laser power meter 8010S (Parts No. J-2501-145-A) (NOTE:)

Oscilloscope (Measure after performing CAL of prove.)

Digital voltmeter

Thermometer

Jig for checking BD board waveform

(Parts No. : J-2501-149-A)

5)When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscillo- scope.

(VC and ground will become short-circuited.)

6)Using the above jig enables the waveform to be checked without the need to solder.

(Refer to Servicing Note on page 6.)

7)As the disc used will affect the adjustment results, make sure

that no dusts nor fingerprints are attached to it.

Note:

When performing laser power checks and adjustment (electrical adjustment), use of the new MD laser power meter 8010S (J-2501- 145-A) instead of the conventional laser power meter is convenient. It sharply reduces the time and trouble to set the laser power meter sensor onto the objective lens of the pick-up.

5-5. CREATING CONTINUOUSLY RECORDED DISC

* This disc is used in focus bias adjustment and error rate check. The following describes how to create a continuous recording disc.

1.Insert a disc (blank disc) commercially available.

2.Rotate the ˜+ knob and display “CREC MODE”.

3.Press the ENTER/YES button again to display “CREC MID”. Display “CREC (0300)” and start to recording.

4.Complete recording within 5 minutes.

5.Press the MENU/NO button and stop recording .

6.Press the § button and remove the disc.

The above has been how to create a continuous recorded data for the focus bias adjustment and error rate check.

Note :

• Be careful not to apply vibration during continuous recording.

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Contents Specifications MDS-JE520MDM-5A MBU-5ASELF-DIAGNOSIS Function Items of Error History Mode Items and Contents Flexible Circuit Board Repairing Specification LabelParts No Table of Contents DisassemblyDiagrams Exploded ViewsSection Servicing Note JIG for Checking BD Board WaveformRecord Precedure Checks Prior to Parts Replacement and Adjustments Criteria for Determination Measure if unsatisfactoryForced Reset Main Board Component SideCleaning of Objective Lens of Optical Pickup Fluorescent Indicator Tube and Mechanism DeckAttaching the Glass Assembly Fluorescent Indicator TUBE, LED Complete Lighting CheckServicing Position Retry Cause Display Mode Higher Bits Lower Bits HexaCause of Retry Occurring conditions BinaryBit When Binary Higher Bits Lower Bits Hexa DetailsHexadecimal Binary Section General Front Panel Location of Parts and ControlsSection Disassembly Glass AssyFront Panel Slider CAM Base Unit and BD BoardSW Board and Loading Motor M103 Section Test Mode Precautions for USE of Test ModeSetting the Test Mode Exiting the Test ModeSelecting the Test Mode GroupOperating the Continuous Playback Mode Non-Volatile Memory Mode EEP ModeFunctions of Other Buttons Test Mode Displays Section Electrical Adjustments Parts Replacement and AdjustmentPrecautions for Checking Laser Diode Emissinon Precautions for USE of Optical PICK- UP KMS-260APrecautions for Adjustments Creating Continuously Recorded DiscTemperature Compensation Offset Check Laser Power CheckChecks Prior to Repairs Specified ValuePlay Checking MO Error Rate Check CD Error Rate CheckFocus Bias Check Self-Recording/playback CheckInitial Setting of Adjustment Value Temperature Compensation Offset AdjutmentLaser Power Adjustment Recording and Displaying the IOP InformationTraverse Adjustment Focus Bias Adjustment Error Rate Check Auto Gain Control Output Level AdjustmentCD Auto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points Section Diagrams Circuit Boards LocationBlock Diagrams BD Section MDS-SD1PB Digital out REC DigitalMain Section PBDigital outRECDigital For schematic diagrams For printed wiring boardsWaveforms Display SectionPrinted Wiring Board BD Section Semiconductor LocationSchematic Diagram BD 1/2 Section Schematic Diagram BD 2/2 Section Schematic Diagram Main 1/2 Section Schematic Diagram Main 2/2 Section Printed Wiring Board Main Section Schematic Diagram Panel Section Printed Wiring Board Panel Section Schematic Diagram Connector Section Printed Wiring Board Connector Section System Control To HCD-SD1MDS-SD1 IC Block Diagrams BD Section IC101IC152 BH6511FS-E2 Main Section IC201 UDA1341TS/N2IC301 LB1641 Connector Section IC774 P82B715TD.118 IC822 M62016FP-E1IC851 M5293L IC PIN Functions IC101 CXA2523AR RF Amplifier BD BoardPin No Pin Name Function IC701 M30610MC-A01FP System Control ∝CON Main Board CHAK-IN Section Exploded Views Case and Back Panel SectionFL901 1-517-804-11 Indicator TUBE, Fluorescent Front Panel SectionPanel SW Board 67 A-4724-619-A Panel BOARD, CompleteMechanism Deck Section MDM-5A Insulator F209 4-988-466-21 Spring ELECTROSTATIC, Leaf Base Unit Section MBU-5A HEAD, Over LightMotor ASSY, Sled Section Electrical Parts List Connector Connector Encoder Main Main Inductor Line FilterFILTER, Line FeritePanel Panel SW Accessories & Packing Materials FILTER, Clamp Ferrite Core MANUAL, Instruction EnglishMANUAL, Instruction CHINESESP,HK Hardware List Screw +BSony Corporation