Sony MDS-JE640 specifications Section Diagrams, Circuit Boards Location, For schematic diagrams

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SECTION 6

DIAGRAMS

6-1. CIRCUIT BOARDS LOCATION

	VOL-SEL board
PT board	(MY, SP model)

KEY-SW board

MAIN board

HP board

KB board

BD board

DISPLAY board

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.

(In addition to this, the necessary note is printed in each block.)

For schematic diagrams.

Note:

•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•f : internal component.

•2: nonflammable resistor.

•1: fusible resistor.

•C: panel designation.

Note:	Note:
The components identi-	Les composants identifiés par
fied by mark 0or dotted	une marque 0sont critiques
line with mark 0are criti-	pour la sécurité.
cal for safety.	Ne les remplacer que par une
Replace only with part	pié ce portant le numé ro
number specified.	spécifié.

•U : B+ Line.

•V : B– Line.

•H: adjustment for repair.

•Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions.

•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

E : PB

j : REC

p: PB (DIGITAL OUT)

l: REC (DIGITAL IN)

•Abbreviation

CND	: Canadian model
SP	: Singapore model
MY	: Malaysia model

For printed wiring boards.

Note:

•X: parts extracted from the component side.

•Y: parts extracted from the conductor side.

•a : Through hole.

•b: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:

Pattern face side: Parts on the pattern face side seen from the

(Side B) pattern face are indicated.

Parts face side: Parts on the parts face side seen from the

(Side A)

parts face are indicated.

• Indication of transistor

B C E

These are omitted.

B C E

These are omitted.

C


			Q							These are omitted.
			Q							These are omitted.

B E

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Contents NEW SpecificationsInputs OutputsThree- or five Digit code Cause/Remedy Message Supplied accessoriesSELF-DIAGNOSIS Function GeneralItems of Error History Mode Items and Contents Exploded Views Table of ContentsDisassembly DiagramsFlexible Circuit Board Repairing Section Service NotesIOP JIG for Checking BD Board WaveformRecord Precedure Forced Reset Checks Prior to Parts Replacement and AdjustmentsMain Board Component Side Bit Binary Retry Cause Display ModeHexadecimal t Binary Conversion Table Section General Front Panel Section Section DisassemblyPT BOARD, VOL-SEL Board Main BoardBD Board Mechanism Deck Section MDM-7AExiting the Test Mode Section Test ModePrecautions for USE of Test Mode Setting the Test ModeDisplay Details Mark Group Selecting the Test ModeMENU/NO Operating the Continuous Playback ModeFunctions of Other Buttons Test Mode DisplaysMode display Error rate displayInformation When Memory NG is DisplayedMeanings of Other Displays Automatic SELF-DIAGNOSIS FunctionParts Replacement and Adjustment Section Electrical AdjustmentsCheck before replacement YES Adjustment flowPrecautions for USE of Optical PICK- UP KMS-260B Precautions for Checking Laser Diode EmissionPrecautions for Adjustments Checks Prior to Repairs Using the Continuously Recorded DiscOther Checks Auto CheckCD Error Rate Check Play Check MO Error Rate CheckTemperature Compensation Offset Adjutment Initial Setting of Adjustment ValueLaser Power Adjustment Iop NV Save Traverse AdjustmentYES Focus Bias AdjustmentMO Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment CD Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points Circuit Boards Location Section DiagramsFor schematic diagrams For printed wiring boardsSignal Path Block Diagrams BD SectionMDS-JE640 REC Analog Main SectionMain Board BD BoardDisplay Board Semiconductor Printed Wiring Board BD SectionPIN PIN Function Printed Wiring Board Main Section Side a IC1 Printed Wiring Board Main Section Side BIC2 PIN MDS-JE640 Schematic Diagram Main /3 See page 47 for IC Block Diagrams Printed Wiring Board Power Section Printed Wiring Board Display Section Schematic Diagram Display Section See page 34 for Waveforms IC101 CXA2523AR BD Board IC Block DiagramsIC400 LA5643 Main Board IC101 CXA2523AR RF Amplifier BD Board IC PIN FunctionsMNT0 FOK Mvci Tfdr IC1 M30805SGP System Control Main Board HLDA/ALE Chassis Section Section Exploded ViewsPanel ASSY, Front Silver Panel ASSY, Front Black AEP,UK,CIS,SP,MY202 220 201 213 215 216 205 218 207 Mechanism MDM-7AMotor ASSY, Loading HEAD, Over LightMotor ASSY, Spindle Motor ASSY, SledSection Electrical Parts List IC BA033FP-E2 IC TC7WU04FUTE12RMetal Chip IC MC74ACT08DTR2Display KEY-SW Main PLUG, Connector 10P Diode PIN, Connector 3PCONNECTOR, FFC 17P PIN, Connector 4PTransistor UN2111-TX IC SN74LVU04ANSRAEP,UK,CIS Transistor UN2211-TXComposition Circuit Block ConnectorTRANSFORMER, Power CND TRANSFORMER, Power SP,MYVOL-SEL Sony Corporation