Sony MDS-JE640 specifications Section Service Notes, Flexible Circuit Board Repairing

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SECTION 1

SERVICE NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The

CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radia- tion exposure.

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of soldering iron around 270˚C during repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS

LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES

DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

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Contents Inputs SpecificationsOutputs NEWSELF-DIAGNOSIS Function Supplied accessoriesGeneral Three- or five Digit code Cause/Remedy MessageItems of Error History Mode Items and Contents Disassembly Table of ContentsDiagrams Exploded ViewsFlexible Circuit Board Repairing Section Service NotesIOP JIG for Checking BD Board WaveformRecord Precedure Main Board Component Side Checks Prior to Parts Replacement and AdjustmentsForced Reset Bit Binary Retry Cause Display ModeHexadecimal t Binary Conversion Table Section General Front Panel Section Section DisassemblyPT BOARD, VOL-SEL Board Main BoardBD Board Mechanism Deck Section MDM-7APrecautions for USE of Test Mode Section Test ModeSetting the Test Mode Exiting the Test ModeDisplay Details Mark Group Selecting the Test ModeMENU/NO Operating the Continuous Playback ModeMode display Test Mode DisplaysError rate display Functions of Other ButtonsMeanings of Other Displays When Memory NG is DisplayedAutomatic SELF-DIAGNOSIS Function InformationCheck before replacement Section Electrical AdjustmentsParts Replacement and Adjustment YES Adjustment flowPrecautions for Adjustments Precautions for Checking Laser Diode EmissionPrecautions for USE of Optical PICK- UP KMS-260B Checks Prior to Repairs Using the Continuously Recorded DiscOther Checks Auto CheckCD Error Rate Check Play Check MO Error Rate CheckLaser Power Adjustment Initial Setting of Adjustment ValueTemperature Compensation Offset Adjutment Iop NV Save Traverse AdjustmentYES Focus Bias AdjustmentAuto Gain Control Output Level Adjustment Error Rate CheckCD Auto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points For schematic diagrams Section DiagramsFor printed wiring boards Circuit Boards LocationMDS-JE640 Block Diagrams BD SectionSignal Path REC Analog Main SectionDisplay Board BD BoardMain Board Semiconductor Printed Wiring Board BD SectionPIN PIN Function Printed Wiring Board Main Section Side a IC2 Printed Wiring Board Main Section Side BIC1 PIN MDS-JE640 Schematic Diagram Main /3 See page 47 for IC Block Diagrams Printed Wiring Board Power Section Printed Wiring Board Display Section Schematic Diagram Display Section See page 34 for Waveforms IC101 CXA2523AR BD Board IC Block DiagramsIC400 LA5643 Main Board IC101 CXA2523AR RF Amplifier BD Board IC PIN FunctionsMNT0 FOK Mvci Tfdr IC1 M30805SGP System Control Main Board HLDA/ALE Chassis Section Section Exploded ViewsPanel ASSY, Front Silver Panel ASSY, Front Black AEP,UK,CIS,SP,MY202 220 201 213 215 216 205 218 207 Mechanism MDM-7AMotor ASSY, Spindle HEAD, Over LightMotor ASSY, Sled Motor ASSY, LoadingSection Electrical Parts List Metal Chip IC TC7WU04FUTE12RIC MC74ACT08DTR2 IC BA033FP-E2Display KEY-SW Main CONNECTOR, FFC 17P PIN, Connector 3PPIN, Connector 4P PLUG, Connector 10P DiodeAEP,UK,CIS IC SN74LVU04ANSRTransistor UN2211-TX Transistor UN2111-TXTRANSFORMER, Power CND ConnectorTRANSFORMER, Power SP,MY Composition Circuit BlockVOL-SEL Sony Corporation