6.2 Block Diagram - Baseband
FLASH/SRAM
LCD
IC 1
I/O CONNECTOR
1DGND
2 | CHG |
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| MODEM | |
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3 |
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GEN I/O |
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4POWER OUT
5 | RX (IN) | TIME |
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6 | TX (OUT) | PROCCESSING |
| AUDIO | |
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| UNIT |
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7 | ACC ID |
| AMP | ||
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8 | RTS | RTC | 32kHz |
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9 | CTS | ||||
| CLK- | ||||
10 | AUDIO OUT |
| CTRL |
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SIM |
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11 | AUDIO IN |
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12 | AGND | Interface | IC 2 |
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| I/F |
| |
Battery |
| IC 1 |
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Connector | Power / CHG | I/F |
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KEYBOARD
JOG
RINGER
HEADSET
AUDIO &
REMOTE
MIC
FLEX-BOARD
JOG DIAL
Multiactor
*Ringer
*Vibrator *Loud- Speaker
Management |
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BATTERY |
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| SIM I/F |
| AUDIO |
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| I/F |
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RTC / ID | HFK I/F | IC 2 |
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SIM |
| SIM LEVEL |
| CTRL 3V/5V | |
Connector |
| |
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A/D CONV | RF I/F | A/D, D/A |
SIM CARD |
RF TCXO
BLOCK
AUDIO | EAR | |
AMP | ||
RECEIVER | ||
|
MIC
6.2.1 General Baseband Indications
The Baseband part consists of two chips, a digital chip IC 1 and an analog one IC 2. The
IC 1
The application of IC 1 is the management of the GSM baseband processes through the GSM layer 1, 2 and 3 protocols as described in the ETSI standard with a specific attention to the power consumption in both GSM dedicated and idle modes.
It is a chip that implements:
the digital baseband processes of the
a
several compiled ports and equivalent CMOS gates.
Full support for
18