Description & Specification
R-CARBON;2KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON(S);270KOHM,5%,1/2W,AA,TP,2.4X6.
R-CARBON(S);39OHM,5%,1/2W,AA,TP,2.4X6.4M
R-CARBON(S);47ohm,5%,1/2W,AA,TP,2.4x6.4m
R-METAL OXIDE(S);51Kohm,5%,2W,AA,TP,4x12
R-METAL;2.2Mohm,5%,1/4W,AA,TP,2.4x6.4m
C-CERAMIC,DISC;10nF,+80-20%,250V,Y5V,-,1
C-CERAMIC,MLC-AXIAL;10nF,+80-20%,25V,Y5V
C-CERAMIC,MLC-AXIAL;4.7nF,10%,50V,X7R,TP
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-FILM,LEAD-PPF;680NF,10%,275V,BK,31X11X
C-AL;10uF,20%,35V,GP,TP,4x7mm,5
C-AL;1uF,20%,50V,GP,TP,4x7,5
C-AL;2200uF,20%,25V,GP,TP,16x25,7.5
C-AL;47uF,20%,50V,GP,TP,6.3x11,2.5
C-AL;470uF,20%,25V,GP,TP,10x16,5
RESONATOR-CERAMIC;8MHz,0.5%,TP,10.0x5.0x
RELAY-POWER;12V DC,0.8W,30000MA,1FORMA,1
RELAY-POWER;12VDC,-,25000MA,1FORMA,20MS,
HEADER-BOARD TO CABLE;BOX,1P,1R,8MM,STRA
HEADER-BOARD TO CABLE;BOX,2P,1R,8MM,STRA
HEADER-BOARD TO CABLE;BOX,13P,1R,2.5mm,S
HEADER-BOARD TO CABLE;BOX,12P,1R,2.5mm,S
HEADER-BOARD TO CABLE;BOX,6P,1R,2.5mm,ST
PLD-MICOM;TMP87PM41N/OTP,DIP,64 PIN
TRANS-POWER;-,MAH2400AW,9PIN,-,230VAC,23
PCB-MAIN;MFS-MDE27-00,FR-4,2,-,T1.6,195
GUIDE-PCB(M);WINGS-DRYER,HIPS,-,-,-,NTR,
CHEMICALS-FLUX SOLDER;KS-77S,-,-,-,-,KOK
CHEMICALS-ALCOHOL;ALL,MODEL,-,-,-,-,-,-
SOLDER-WIRE;S63S,D3.0,-,-,-,-,-,-,-
SOLDER-WIRE FLUX;RS60S,-,D1.2,60SN/40PB,
IC-OP AMP;KA2904,DIP,-,-,-,-,-
IC-VOLT REGU;KA7805A,TO-220AB,1A,0/125C,
IC-DRIVE;KID65003AP,DIP,16P,STICK,TR-AR
FILTER-EMI BEAD;S,80/100MHZ-MIN65,T,BFS3
BUZZER;CBE2220BA,STICK,-,-,-,-,-,-,-
SCREW-TAPPING;TH,+,-,2S,M4,L8,ZPC(YEL),S
CABLE CLAMP;DAWH-18NB,ID15,-,NYLON66,NTR
CLAMPER-WIRE SADDLE;-,NYLON#66(DAWS-6NB)
ASSY-FRAME CASE;DV316LGW/XAA,FRONTIER-DR
SCREW-TAPPING;TH,+,-,2S,M4,L12,ZPC(YEL),
SCREW-TAPPING;TH,+,-,2S,M4,L8,ZPC(YEL),S
SCREW-TAPPING;TH,+,WT,C-TITE,M4,L10,ZPC(
SCREW-TAPPING;TH,+,WT,TC,M4,L10,ZPC(YEL)
