HP 6005 manual Usa, Mtbf, Emi-Rfi

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QuickSpecs

HP Compaq 6005 Pro Business PC

Technical Specifications - Input/Output Devices

 

 

Interface modes

USB communications through USB port

 

 

 

SCM protocol

 

 

 

 

Automatic card insertion/removal detection

 

 

Reader performance

USB connection

 

 

 

interface

 

 

 

 

Electro-magnetic

Europe

89/336/CEE guideline

 

 

standards

USA

USAFCC part 15

 

 

 

 

HP USB 2-Button Laser Scroll Wheel

24

 

 

Mouse

Maximum Rotation

48 rats/sec

 

 

 

Speed

 

 

 

 

Switch Type

wheel

 

 

 

Switch Life

Button - 3,000,000

 

 

 

 

Wheel - 1,000,000 times

 

 

 

 

Tilt switch - 500,000 times

 

 

Environmental

Operating Temperature32° to 104° F (0° to 40° C)

 

 

Non-operating

-4° to 140° F (-20° to 60° C)

 

 

Temperature

 

 

 

 

Operating Humidity

10% to 90% (non-condensing at ambient)

 

 

Non-operating

20% to 80% (non-condensing at ambient)

 

 

Humidity

 

 

 

 

Operating Shock

40 g, six surfaces

 

 

 

Non-operating Shock

80 g, six surfaces

 

 

 

Operating Vibration

2-g peak acceleration

 

 

 

Non-operating

4-g peak acceleration

 

 

 

Vibration

 

 

 

Electrical

Operating Voltage

+ 5VDC ± 5%

 

 

 

Power Consumption

 

 

 

 

MTBF

> 150,000 hrs

 

 

 

ESD

IEC-61000-4-2 criteria B, Contact discharge:

 

 

 

+/- 4kV, Air discharge: +/- 8kV

 

 

EMI-RFI

FCC Class B

 

 

 

PC98

PC 99 Compliant

 

 

Mechanical

Resolution

800dpi

 

 

 

Tracking Speed

25 cm/sec

 

 

 

Acceleration

0.5mm

 

 

 

Switch Actuation

0.6N (60gf)

 

 

 

Switch Life

Button - 3,000,000

 

 

 

 

Wheel - 1,000,000 times

 

 

 

Tilt switch - 500,000 times

 

 

Cable Length

1850mm

 

 

 

PC98-99

PC99 compliant

 

Regulatory Approvals UL60950-1, UL 94, UL 746 (A-E), UL 796 TUV/GS: EN 60950-1, EN 60825-1

FCC Class B, UL 1950, cUL, TUV GS, CE, C-tick, VCCI, BSMI, RRL

DA - 13412 Worldwide QuickSpecs — Version 6 — 10/14/2009

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Contents Overview MicrotowerAt a Glance Small Form FactorQuickSpecs Configurable Components Select Models localized by Regions Model Key and ExampleSupported Operating System PreinstalledCertified Features Value-added ServicesValue-added Software SFF AMD Sempron Processors with HyperTransport Technology ProcessorMemory Supports un-buffered non-ECC DDR3 Sdram IDE Drive Hard DriveNIC Input Devices GraphicsAudio MiscellaneousAfter-Market Options availability may vary by region Multimedia AccessoriesMonitors Optical Drives DVD-ROM DriveMicrotower Small Form Factor Power Supply Technical SpecificationsTemperature Range Relative HumidityROM Bios Information Other Features DescriptionServiceability Features of Chassis Serviceability Features of SystemAdditional Features Description Codec Audio Jacks Technical Specifications AudioHigh Definition Audio Type External Speaker Jack Yes Line-OutTechnical Specifications Communications Power consumption Platform/WLAN Mode WeightStorage temperature Output power approximatelyAntenna Data transfer rate Data Rate MCS Minimum ThroughputCertifications EMC Technical Specifications Graphics ATI Radeon HD MB DH PCIe Graphics Card Bus type Display max resolutionBoard configuration Specification Description Maximum vertical refreshRamdac Adapter weight Display ResolutionAPIs HP DisplayPort to DVI Connectors SupportQuickSpecs Technical Specifications Internal Storage 10,000 RPM Serial ATA 160-GB Hard Drives 80-GB Capacity CachePower DC power requirement Dimensions-externalHost transfer rate Ultra DMA mode Total powerESD Technical Specifications Input/Output DevicesEMI RFI Mechanical Languages Dimensions H x W x DPS/2 Standard Physical Keys HP USB Smartcard Physical KeysStandard APIs Supported PowerSmartcard function Support Communication From cardMtbf USAEMI-RFI HP PS/2 Optical Scroll Mouse ESD EMI-RFITechnical Specifications Optical Storage DVD+RW, DVD-RW DVD+R DLDVD-R DL DVD+R DL, DVD-R DL DVD-ROM DLDVD-ROM CD-R Technical Specifications Removable Storage Connectivity Design Guide V Technical Specifications Environmental Data Packaging Materials External InternalRoHS Compliance Material UsageManagement Recycling PackagingEnd-of-life Hewlett-Packard