HP 6005 manual Packaging, End-of-life, Management Recycling, Hewlett-Packard, Corporate

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QuickSpecs

HP Compaq 6005 Pro Business PC

Technical Specifications - Environmental Data

 

Polybrominated Biphenyl Oxides (PBBOs)

 

Polychlorinated Biphenyl (PCB)

 

Polychlorinated Terphenyls (PCT)

 

Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has

 

been voluntarily removed from most applications.

 

Radioactive Substances

 

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

 

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in

 

packaging materials.

 

Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

 

Design packaging materials for ease of disassembly.

 

Maximize the use of post-consumer recycled content materials in packaging materials.

 

Use readily recyclable packaging materials such as paper and corrugated materials.

 

Reduce size and weight of packages to improve transportation fuel efficiency.

 

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic

Management and

areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest

Recycling

HP sales office. Products returned to HP will be recycled, recovered or disposed of in a

 

responsible manner.

 

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for

 

each product type for use by treatment facilities. This information (product disassembly

 

instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These

 

instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM

 

customers who integrate and re-sell HP equipment.

Hewlett-Packard

For more information about HP's commitment to the environment:

Corporate

Global Citizenship Report

Environmental

http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

Information

Eco-label certifications

 

http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html

 

ISO 14001 certificates:

 

http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html

 

 

 

Copyright © 2009 Hewlett-Packard Development Company, L.P.

All rights reserved. Microsoft, Windows, Windows Vista, and Windows 7 are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. Phenom, Athlon and Sempron are registered trademarks or trademarks of AMD Corporation in the U.S. and/or other countries. All other product names mentioned herein may be trademarks of their respective companies.

The information contained herein is subject to change without notice and is provided "as is" without warranty of any kind. The warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

DA - 13412 Worldwide QuickSpecs — Version 6 — 10/14/2009

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Contents Overview MicrotowerAt a Glance Small Form FactorQuickSpecs Configurable Components Select Models localized by Regions Model Key and ExampleCertified Operating System PreinstalledSupported Value-added Software Value-added ServicesFeatures SFF Memory Supports un-buffered non-ECC DDR3 Sdram ProcessorAMD Sempron Processors with HyperTransport Technology IDE Drive Hard DriveNIC Graphics AudioInput Devices MiscellaneousAfter-Market Options availability may vary by region Accessories MonitorsMultimedia Optical Drives DVD-ROM DriveTechnical Specifications Temperature RangeMicrotower Small Form Factor Power Supply Relative HumidityROM Bios Information Other Features DescriptionAdditional Features Description Serviceability Features of SystemServiceability Features of Chassis Technical Specifications Audio High Definition Audio TypeCodec Audio Jacks External Speaker Jack Yes Line-OutTechnical Specifications Communications Weight Storage temperaturePower consumption Platform/WLAN Mode Output power approximatelyCertifications Data transfer rate Data Rate MCS Minimum ThroughputAntenna EMC Technical Specifications Graphics Display max resolution Board configuration Specification DescriptionATI Radeon HD MB DH PCIe Graphics Card Bus type Maximum vertical refreshRamdac Display Resolution APIs HP DisplayPort to DVI ConnectorsAdapter weight SupportQuickSpecs Technical Specifications Internal Storage 10,000 RPM Serial ATA 160-GB Hard Drives 80-GB Capacity CacheDimensions-external Host transfer rate Ultra DMA modePower DC power requirement Total powerEMI RFI Technical Specifications Input/Output DevicesESD Dimensions H x W x D PS/2 Standard Physical KeysMechanical Languages HP USB Smartcard Physical KeysSupported Power Smartcard function SupportStandard APIs Communication From cardEMI-RFI USAMtbf HP PS/2 Optical Scroll Mouse ESD EMI-RFITechnical Specifications Optical Storage DVD+R DL DVD-R DLDVD+RW, DVD-RW DVD+R DL, DVD-R DL DVD-ROM DLDVD-ROM CD-R Technical Specifications Removable Storage Connectivity Design Guide V Technical Specifications Environmental Data Packaging Materials External InternalRoHS Compliance Material UsagePackaging End-of-lifeManagement Recycling Hewlett-Packard