HP 6005 manual Technical Specifications Internal Storage

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QuickSpecs

HP Compaq 6005 Pro Business PC

Technical Specifications - Internal Storage

7200 RPM Serial ATA 500-GB

Capacity

500,107,862,016 bytes

 

Hard Drives

Height

1 in (2.54 cm)

 

 

Width

Media diameter: 3.5 in (8.89 cm)

 

 

Physical size: 4 in (10.2 cm)

 

Interface

Serial ATA (3.0 Gb/s)

 

 

Synchronous Transfer

Up to 3 Gb/s

 

 

Rate (Maximum)

 

 

 

Buffer

16 MB

 

 

Seek Time (typical

Single Track

2.0 ms

 

reads, includes controller Average

11 ms

 

overhead, including

Full-Stroke

21 ms

 

settling)

 

Rotational Speed

7,200 rpm

 

 

Logical Blocks

976,773,168

 

 

Operating Temperature41° to 131° F (5° to 55° C)

320-GB

Capacity

320,072,933,376 bytes

 

 

Height

1 in (2.54 cm)

 

 

Width

Media diameter: 3.5 in (8.89 cm)

 

 

Physical size: 4 in (10.2 cm)

 

Interface

Serial ATA (3.0 Gb/s)

 

 

Synchronous Transfer

Up to 3 Gb/s

 

 

Rate (Maximum)

 

 

 

Buffer

8 MB

 

 

Seek Time (typical

Single Track

1.0 ms

 

reads, includes controller Average

8.5 ms

 

overhead, including

Full-Stroke

18 ms

 

settling)

 

Rotational Speed

7,200 rpm

 

 

Logical Blocks

625,142,448

 

 

Operating Temperature41° to 131° F (5° to 55° C)

250-GB

Capacity

250,059,350,016 bytes

 

 

Height

1 in (2.54 cm)

 

 

Width

Media diameter: 3.5 in (8.89 cm)

 

 

Physical size: 4 in (10.2 cm)

 

Interface

Serial ATA (3.0 Gb/s)

 

 

Synchronous Transfer

Up to 3 Gb/s

 

 

Rate (Maximum)

 

 

 

Buffer

8 MB

 

 

Seek Time (typical

Single Track

1.0 ms

 

reads, includes controller Average

8.5 ms

 

overhead, including

Full-Stroke

18 ms

 

settling)

 

Rotational Speed

7,200 rpm

 

 

Logical Blocks

488,397,168

 

 

Operating Temperature41° to 131° F (5° to 55° C)

160-GB

Capacity

160,041,885,696 bytes

 

 

Height

1 in (2.54 cm)

 

DA - 13412 Worldwide QuickSpecs — Version 6 — 10/14/2009

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Contents Overview MicrotowerAt a Glance Small Form FactorQuickSpecs Configurable Components Select Models localized by Regions Model Key and ExampleSupported Operating System PreinstalledCertified Features Value-added ServicesValue-added Software SFF AMD Sempron Processors with HyperTransport Technology ProcessorMemory Supports un-buffered non-ECC DDR3 Sdram IDE Drive Hard DriveNIC Graphics AudioInput Devices MiscellaneousAfter-Market Options availability may vary by region Accessories MonitorsMultimedia Optical Drives DVD-ROM DriveTechnical Specifications Temperature RangeMicrotower Small Form Factor Power Supply Relative HumidityROM Bios Information Other Features DescriptionServiceability Features of Chassis Serviceability Features of SystemAdditional Features Description Technical Specifications Audio High Definition Audio TypeCodec Audio Jacks External Speaker Jack Yes Line-OutTechnical Specifications Communications Weight Storage temperaturePower consumption Platform/WLAN Mode Output power approximatelyAntenna Data transfer rate Data Rate MCS Minimum ThroughputCertifications EMC Technical Specifications Graphics Display max resolution Board configuration Specification DescriptionATI Radeon HD MB DH PCIe Graphics Card Bus type Maximum vertical refreshRamdac Display Resolution APIs HP DisplayPort to DVI ConnectorsAdapter weight SupportQuickSpecs Technical Specifications Internal Storage 10,000 RPM Serial ATA 160-GB Hard Drives 80-GB Capacity CacheDimensions-external Host transfer rate Ultra DMA modePower DC power requirement Total powerESD Technical Specifications Input/Output DevicesEMI RFI Dimensions H x W x D PS/2 Standard Physical KeysMechanical Languages HP USB Smartcard Physical KeysSupported Power Smartcard function SupportStandard APIs Communication From cardMtbf USAEMI-RFI HP PS/2 Optical Scroll Mouse ESD EMI-RFITechnical Specifications Optical Storage DVD+R DL DVD-R DLDVD+RW, DVD-RW DVD+R DL, DVD-R DL DVD-ROM DLDVD-ROM CD-R Technical Specifications Removable Storage Connectivity Design Guide V Technical Specifications Environmental Data Packaging Materials External InternalRoHS Compliance Material UsagePackaging End-of-lifeManagement Recycling Hewlett-Packard