HP 6005 manual Packaging Materials External, Internal

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QuickSpecs

HP Compaq 6005 Pro Business PC

Technical Specifications - Environmental Data

Packaging Materials External

 

Corrugated Paper

1835 g

Internal

 

Polyethylene low density solid

150 g

Polyethylene low density foam

20 g

The Polyethylene low density foam packaging material is made from 100% recycled content.

The Polyethylene low density Solid packaging material is made from 100% recycled content.

The corrugated packaging material contains at least 30% recycled content.

Small Form Factor

Eco-Label

This product has received or is in the process of being certified to the following approvals and may

Certifications &

be labeled with one or more of these marks:

declarations

US Energy Star

 

 

IT ECO declaration

 

EPEAT – Silver

System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the

Small Form Factor model is based on a typically configured product.

Energy Consumption

115 VAC

230 VAC

100 VAC

Normal Operation

27.4159 W

27.1680 W

27.7080 W

Sleep (Energy Star low

2.5527 W

2.7644 W

2.5316 W

power mode)

 

 

 

Off

0.7149 W

0.8667 W

0.7003 W

Heat Dissipation*

115 VAC

230 VAC

100 VAC

Normal Operation

94 BTU/hr

93 BTU/hr

95 BTU/hr

Sleep

9 BTU/hr

9 BTU/hr

9 BTU/hr

Off

2 BTU/hr

3 BTU/hr

2 BTU/hr

* Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

Declared Noise

Emissions

(in accordance with ISO 7779 and ISO 9296)

 

Sound Power

Sound Pressure

System Fan Off

(LWAd, bels)

(LpAm, decibels)

Idle

3.8

27

Fixed Disk (random

3.9

28

writes)

 

 

DA - 13412 Worldwide QuickSpecs — Version 6 — 10/14/2009

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Contents Overview MicrotowerAt a Glance Small Form FactorQuickSpecs Configurable Components Select Models localized by Regions Model Key and ExampleOperating System Preinstalled SupportedCertified Value-added Services FeaturesValue-added Software SFF Processor AMD Sempron Processors with HyperTransport TechnologyMemory Supports un-buffered non-ECC DDR3 Sdram IDE Drive Hard DriveNIC Input Devices GraphicsAudio MiscellaneousAfter-Market Options availability may vary by region Multimedia AccessoriesMonitors Optical Drives DVD-ROM DriveMicrotower Small Form Factor Power Supply Technical SpecificationsTemperature Range Relative HumidityROM Bios Information Other Features DescriptionServiceability Features of System Serviceability Features of ChassisAdditional Features Description Codec Audio Jacks Technical Specifications AudioHigh Definition Audio Type External Speaker Jack Yes Line-OutTechnical Specifications Communications Power consumption Platform/WLAN Mode WeightStorage temperature Output power approximatelyData transfer rate Data Rate MCS Minimum Throughput AntennaCertifications EMC Technical Specifications Graphics ATI Radeon HD MB DH PCIe Graphics Card Bus type Display max resolutionBoard configuration Specification Description Maximum vertical refreshRamdac Adapter weight Display ResolutionAPIs HP DisplayPort to DVI Connectors SupportQuickSpecs Technical Specifications Internal Storage 10,000 RPM Serial ATA 160-GB Hard Drives 80-GB Capacity CachePower DC power requirement Dimensions-externalHost transfer rate Ultra DMA mode Total powerTechnical Specifications Input/Output Devices ESDEMI RFI Mechanical Languages Dimensions H x W x DPS/2 Standard Physical Keys HP USB Smartcard Physical KeysStandard APIs Supported PowerSmartcard function Support Communication From cardUSA MtbfEMI-RFI HP PS/2 Optical Scroll Mouse ESD EMI-RFITechnical Specifications Optical Storage DVD+RW, DVD-RW DVD+R DLDVD-R DL DVD+R DL, DVD-R DL DVD-ROM DLDVD-ROM CD-R Technical Specifications Removable Storage Connectivity Design Guide V Technical Specifications Environmental Data Packaging Materials External InternalRoHS Compliance Material UsageManagement Recycling PackagingEnd-of-life Hewlett-Packard